Electronic Component Moisture Isolation via Electrode Spacing
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Solution Overview
Problem
Multilayer electronic components face degradation due to moisture absorption, leading to compromised insulating properties and potential short circuits between dielectric layers.
Innovation Solution
An electronic component design featuring a laminate with embedded internal conductors and external electrodes that are spaced at least 0.8 μm away from exposed portions, preventing moisture absorption and maintaining insulating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrode is formed by plating the exposed portion of the internal electrode, then the electrical connectivity is ensured, but the laminate absorbs moisture leading to degradation of insulating properties
Solution Approach 1:
The patent introduces an organic solvent-resistant coating layer as an intermediary between the external electrode and the laminate. This coating layer prevents moisture from penetrating into the laminate while allowing the external electrode to maintain electrical connectivity with the internal electrode. The coating acts as a barrier that mediates between the conductive electrode and the insulating laminate, protecting the laminate from moisture absorption.
Solution Approach 2:
The patent applies a preliminary protective coating on the laminate surface before forming the external electrode. This pre-coating prevents moisture absorption in advance, addressing the harmful effect before it can occur. The coating is applied to the exposed portions of the laminate where internal electrodes will be plated, creating a protective barrier that prevents subsequent moisture ingress during assembly and operation.
2Reliability
If the external electrode covers the exposed portion of the internal electrode, then electrical connectivity is maintained, but appearance defects occur due to moisture-related degradation
Solution Approach 1:
The organic solvent-resistant coating serves as a protective intermediary that prevents moisture-related degradation of the laminate surface. By blocking moisture access, the coating prevents discoloration, swelling, or other appearance defects that would otherwise occur on the laminate surface near the external electrode, while still allowing the electrode to function properly.
3Ease of manufacture
If the laminate structure is simplified with direct plating, then manufacturing complexity is reduced, but moisture absorption causes short circuits between dielectric layers
Solution Approach 1:
The coating layer is applied as an additional step in the manufacturing process, serving as a simple yet effective intermediary that prevents moisture-induced short circuits. While it adds one manufacturing step, it maintains the simplicity of the direct plating approach while ensuring reliability by preventing moisture from penetrating between dielectric layers and causing short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents degradation and short circuits by isolating the laminate from moisture, ensuring reliable performance and preventing appearance defects in the external electrodes.
Implementation Method 1
a first external electrode provided on the predetermined surface by direct plating so as to cover the first exposed portion
Data Source
AI summary
An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more.