Electronic component mounting structure and outdoor unit of air conditioner
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Solution Overview
Problem
Existing electronic component mounting structures for air conditioners suffer from inefficient heat dissipation and vibration-induced fatigue failures, particularly due to the low flexibility and poor contact area of heat dissipation sheets.
Innovation Solution
An electronic component mounting structure that incorporates a metal plate and a flexible, elastic heat dissipation component. The heat dissipation component is sandwiched between the metal plate and the electronic component, allowing it to deform and maintain intimate contact, enhancing heat transfer and vibration suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation sheet is used to transfer heat from the electronic component, then heat dissipation function is provided, but the contact area between the electronic component and heat dissipation sheet is small due to low flexibility, resulting in inefficient heat transfer
Solution Approach 1:
The patent replaces the traditional rigid heat dissipation sheet with a flexible heat dissipation component that can deform to conform to the electronic component's surface. This flexible component maintains intimate contact across the entire contact area, significantly improving heat transfer efficiency by eliminating the contact area limitation of rigid sheets.
Solution Approach 2:
The patent changes the physical state parameters of the heat dissipation component by selecting materials with specific flexibility and elasticity characteristics. This allows the component to adapt its shape and maintain optimal contact pressure, thereby maximizing the contact area and heat dissipation efficiency simultaneously.
2Stability of the object's composition
If a rigid heat dissipation sheet is used, then structural stability is maintained, but vibration of the electronic component during transportation causes fatigue failure at joint portions
Solution Approach 1:
The flexible heat dissipation component acts as a vibration-dampening element between the electronic component and the rigid housing. Its elasticity allows it to absorb vibration energy, reducing the transmission of vibrational stresses to joint portions and preventing fatigue failure while maintaining structural stability.
Solution Approach 2:
The heat dissipation component is designed to provide cushioning protection in advance against potential vibration damage. By positioning this flexible element between the electronic component and the housing during assembly, it preemptively absorbs and mitigates vibration shocks that may occur during transportation, preventing fatigue failure before it occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure significantly improves heat dissipation performance by increasing the contact area and adhesion between the electronic component and the heat dissipation component, while also effectively suppressing vibration and preventing fatigue failures.
Implementation Method 1
The electronic component and the metal plate are thermally connected via the heat dissipation component
Implementation Method 2
a heat dissipation component having flexibility and elasticity
Implementation Method 3
suppress the vibration of the electronic component
Data Source
AI summary
An electronic component mounting structure includes an electronic component, a metal plate having one surface and another surface, and a heat dissipation component having flexibility and elasticity. The heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along the shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate. The electronic component and the metal plate are thermally connected via the heat dissipation component.


