Electronic Component With Fine-Particle Ni Plated Layer
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Solution Overview
Problem
Conventional electronic components experience degradation of electrical characteristics due to hydrogen atoms diffusing into the body portion when a Ni plated layer is formed, leading to reduced insulation resistance.
Innovation Solution
An electronic component design featuring a base electrode layer with a first Ni plated layer and an upper plated layer, where the first Ni plated layer includes Ni particles with an average particle size of not more than 52 nm, effectively trapping hydrogen atoms and preventing their diffusion into the body portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a Ni plated layer is formed on the base electrode layer, then solder wettability is improved, but hydrogen atoms diffuse into the body portion causing degradation of electrical characteristics
Solution Approach 1:
The Ni plated layer is divided into two distinct layers: a first Ni plated layer with fine particles (average diameter 5 μm or less) that traps hydrogen atoms, and a second Ni plated layer with coarse particles (average diameter 5 μm or more) that provides solder wettability. This segmentation allows each layer to perform its specific function without interfering with the other.
Solution Approach 2:
Different regions of the plated layer structure are assigned different properties: the first Ni plated layer (closer to the base electrode) has fine particle structure optimized for hydrogen trapping, while the second Ni plated layer (outer layer) has coarse particle structure optimized for solder wettability. This local differentiation resolves the contradiction between hydrogen prevention and solderability.
2Device complexity
If conventional Ni plated layer is used, then manufacturing process is simple, but hydrogen atom diffusion degrades insulation resistance
Solution Approach 1:
The plated layer is segmented into two layers with different particle size distributions. The first layer with fine Ni particles creates a dense structure that acts as a barrier to hydrogen diffusion, protecting the body portion and maintaining insulation resistance.
Solution Approach 2:
The plated layer uses a composite structure combining two types of Ni particles with different size characteristics. This composite approach creates a multi-functional layer that simultaneously provides hydrogen barrier properties and maintains electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces or prevents the degradation of electrical characteristics by minimizing hydrogen atom diffusion, thereby maintaining insulation resistance and improving solder wettability.
Implementation Method 1
The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm... effectively trapping hydrogen atoms and preventing their diffusion into the body portion
Data Source
AI summary
An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.