Electronic Component Package Wiring Inspection
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Solution Overview
Problem
Conventional electronic component packaging methods require electrical testing after component mounting, leading to significant waste when the package is defective, as both the component and wiring layer may need to be discarded.
Innovation Solution
An electronic component package design that includes a wiring part with an insulating layer and conductive pattern, a frame with a through hole for the component, an adhesive layer bonding the parts, and an encapsulant, allowing for pre-mounting electrical inspection and reducing unnecessary component disposal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical testing is performed after component mounting, then the package can be tested for functionality, but significant waste occurs when the package is defective as both the component and wiring layer must be discarded
Solution Approach 1:
The patent performs electrical testing on the wiring layer before mounting the electronic component. This preliminary action allows detection of wiring defects prior to component attachment, preventing waste of both the expensive component and wiring layer when defects are found, thereby resolving the contradiction between ensuring package reliability and minimizing material waste
2Volume of moving object
If the package structure is miniaturized to meet demand for smaller components, then component size is reduced, but the complexity of manufacturing and testing increases
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: wiring layer fabrication, electrical testing of wiring layer, component mounting, and final package testing. This segmentation allows the wiring layer to be tested independently before component attachment, simplifying the overall manufacturing process despite miniaturization requirements and enabling defect detection at appropriate stages without increasing overall complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency by enabling electrical testing of the wiring part before component mounting, minimizing waste and optimizing resource utilization.
Implementation Method 1
an adhesive layer bonding the wiring part and the frame to each other
Data Source
AI summary
An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a through hole accommodating the electronic component, an adhesive layer bonding the wiring part and the frame to each other, and an encapsulant filling at least a portion of the through hole.