Electronic Component External Electrode Plated Layer Resistance
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Solution Overview
Problem
Conventional chip-type electronic components with conductive resin external electrodes experience increased resistance due to contact resistance between conductive particles, leading to higher electrical resistance values compared to components with baked electrodes.
Innovation Solution
The electronic component features a conductive material-containing resin layer with metal particles, covered by a plated layer that extends into the resin layer, connecting to internal electrodes and reducing contact resistance, with a Ni and Sn plated layer structure that coats metal particles and extends to the electronic component body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conductive resin layer with conductive particles is used as the external electrode, then the manufacturing process is simplified and cost is reduced, but the resistance value increases due to contact resistance between particles
Solution Approach 1:
A plated layer (Ni and Sn) is introduced as an intermediary between the conductive particles in the resin layer and the internal electrode. This plated layer extends into the resin layer to directly contact and plate the conductive particles, while also connecting to the internal electrode, thereby mediating the electrical connection and reducing contact resistance between the resin-based external electrode and internal electrode
Solution Approach 2:
The plated layer changes the electrical contact parameters by creating direct metal-to-particle contact instead of particle-to-particle contact. The plating process modifies the surface properties and electrical characteristics of the conductive particles, reducing contact resistance and improving conductivity
2Ease of manufacture
If conductive particles are used in the resin layer, then the external electrode can be formed by screening methods, but contact resistance between multiple particles increases the resistance value
Solution Approach 1:
The plated layer serves as an intermediary that consolidates the electrical connection path. Instead of relying on multiple particle-to-particle contacts, the plated layer creates direct contact with conductive particles and the internal electrode, reducing the number of contact interfaces and improving resistance control
Solution Approach 2:
The external electrode becomes a composite structure combining the resin layer with conductive particles and the plated layer. This composite structure leverages the advantages of each material: the resin provides formability and adhesion, the conductive particles provide conductivity, and the plated layer provides low-resistance electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the resistance value and enhances the reliability of the connection between the external and internal electrodes, maintaining low resistance even in high-temperature environments.
Implementation Method 1
a plated layer covering the conductive material-containing resin layer, the plated layer extends from the surface of the conductive material-containing resin layer into an inside of the conductive material-containing resin layer, and coats at least some of the metal particles
Data Source
AI summary
An electronic component body includes an internal electrode that is partially extended to a surface of the electronic component body and is connected to an external electrode including a conductive material-containing resin layer including a conductive material and a resin layer and a plated layer covering the conductive material-containing resin layer. The conductive material-containing resin layer includes metal particles as the conductive material, and the plated layer extends from the surface of the conductive material-containing resin layer into the conductive material-containing resin layer such that the plated layer coats at least some of the metal particles.