Electronic Component Plating Film Dimension Control
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Solution Overview
Problem
Variations in the dimension of plating growth of external electrodes in electronic components, particularly coil components, lead to inconsistencies in characteristics and appearance, due to unpredictable plating growth patterns during the electrolytic plating process.
Innovation Solution
The electronic component design incorporates underlying main and sub-electrodes with distinct exposed areas and positions, where the sub-electrode is positioned along the specific end edge and has a smaller exposed area compared to the main electrode, which is farther from the end edge, to control and suppress plating growth variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electrolytic plating is performed using conventional seed electrodes, then external electrodes are formed on the electronic component body, but variations in plating growth dimension occur leading to inconsistencies in characteristics and appearance
Solution Approach 1:
The seed electrode is divided into multiple separate electrodes (first seed electrode and second seed electrode) positioned at different locations on the electronic component body. This segmentation allows independent control of plating growth from each seed electrode, enabling precise control over the final plating dimensions and reducing variations in plating growth consistency.
Solution Approach 2:
Different seed electrodes are provided with different exposed areas tailored to their specific positions on the electronic component body. The first seed electrode has a different exposed area than the second seed electrode, allowing each to contribute appropriately to plating growth in its local region, thereby achieving uniform overall plating dimensions despite variations in local geometric conditions.
2Productivity
If the exposed area of seed electrodes is increased to enhance plating growth, then plating film formation is improved, but plating growth variations increase leading to appearance defects
Solution Approach 1:
Each seed electrode is assigned a specific exposed area optimized for its position and function. The first seed electrode has a different exposed area than the second seed electrode, allowing each to promote efficient plating growth in its local region without causing excessive or uneven growth that would lead to appearance defects or non-linear end edges.
Solution Approach 2:
The plating growth process is controlled by the interaction between multiple seed electrodes with different exposed areas, creating a self-regulating system where the overall plating dimension is determined by the combined effect of all seed electrodes. This feedback mechanism ensures that plating growth stops at the appropriate position, maintaining linear end edges while preserving formation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent plating growth dimensions, reduces variations in electronic component characteristics, and enhances the appearance and performance of external electrodes by defining the end point of plating growth, resulting in improved linearity and efficiency of plating film formation.
Implementation Method 1
external electrodes including plating films formed on the outer surface of the electronic component body by electrolytic plating using the underlying electrodes as a seed electrode
Data Source
AI summary
An electronic component capable of suppressing variations in dimension of plating growth of a plating film serving as an external electrode. The external electrodes include plating films formed so as to extend from each of end surfaces to side surfaces of an electronic component body by electrolytic plating. Underlying main electrodes in which the degree of plating growth is relatively high, and underlying sub-electrodes in which the degree of plating growth is relatively low, are formed as a seed electrode serving as a starting point of plating growth for forming a plating film.