Electronic Component Projection for Bonding Strength
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Solution Overview
Problem
Conventional electronic components with coils on insulating base materials face challenges in securing sufficient bonding strength to mounting substrates due to interference from magnetic flux and material mismatches, leading to potential detachment risks.
Innovation Solution
The electronic component design includes a projection on the insulating base material's surface, which increases the bonding area with the insulating bonding material, enhancing the bonding strength and preventing peeling, even with a higher dielectric constant bonding material, and features a recess or through-hole to reduce stray capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a large mounting electrode is formed on the mounting surface, then the bonding strength to the mounting substrate is improved, but the magnetic flux passing through the coil is interfered with
Solution Approach 1:
The mounting surface is divided into two functional zones: a mounting electrode region for electrical connection and bonding, and an electrode non-forming portion for magnetic flux passage. This segmentation allows the mounting electrode to provide sufficient bonding strength while the electrode non-forming portion prevents magnetic flux interference, resolving the contradiction between bonding strength and magnetic flux interference.
2Object-generated harmful factors
If the area of the mounting electrode is reduced to prevent magnetic flux interference, then the magnetic flux passing through the coil is protected, but the bonding strength to the mounting substrate is insufficient
Solution Approach 1:
The mounting surface is segmented into a mounting electrode with sufficient area for strong bonding and an adjacent electrode non-forming portion that allows magnetic flux to pass without interference. This spatial segmentation enables both requirements to be satisfied simultaneously: the mounting electrode provides adequate bonding strength while the electrode non-forming portion protects magnetic flux.
3Strength
If bonding material with higher dielectric constant is used to improve bonding strength, then the bonding strength is enhanced, but the stray capacitance increases
Solution Approach 1:
The electrode non-forming portion acts as an intermediary structure between the mounting electrode and the mounting substrate. It provides a physical path for magnetic flux while allowing the use of high dielectric constant bonding material in the mounting electrode region to achieve strong bonding, thereby resolving the contradiction between bonding strength and stray capacitance.
4Strength
If a projection is added to increase bonding area, then the bonding strength is improved, but the device complexity increases
Solution Approach 1:
The projection is integrated into the insulating base material itself rather than being a separate component. This merging approach increases the bonding area and improves bonding strength while avoiding the complexity of adding separate projection structures, as the projection is formed as part of the base material manufacturing process.
Data Source
AI summary
An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.