Electronic Component Recessed Electrode Resin Anchoring

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Solution Overview

Problem

In electronic component built-in boards, the difference in thermal expansion coefficients between electronic components and interlayer insulation layers can cause separation when exposed to high temperatures, leading to reliability issues.

Innovation Solution

The design incorporates electronic components with recesses in their outer electrodes, allowing resin from the multilayer printed circuit substrate to fill these recesses, providing an anchor effect that prevents separation even at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic components are incorporated in multilayer printed circuit substrates, then the board can be made small-sized and thin, but the electronic component and interlayer insulation layer may separate when exposed to high temperature due to different thermal expansion coefficients

Engineering Contradiction:

Improveboard sizeVSAvoidbonding strength

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The outer electrode is designed with a porous structure containing multiple recesses, allowing the resin to penetrate and fill these recesses. This creates a mechanical interlocking effect that significantly enhances the bonding strength between the electronic component and the interlayer insulation layer, preventing separation under thermal stress while maintaining the compact board design

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The invention creates a composite structure where the resin penetrates into the porous outer electrode, forming an integrated bond between the electronic component and the interlayer insulation layer. This composite approach combines the advantages of both materials while mitigating their individual weaknesses regarding thermal expansion mismatch

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the outer electrode surface is made smooth for easy manufacturing, then manufacturing precision is improved, but the resin cannot effectively anchor to prevent separation at high temperatures

Engineering Contradiction:

Improveelectrode surface qualityVSAvoidthermal stability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The outer electrode intentionally incorporates a porous structure with controlled recesses, transforming the smooth surface requirement into a structured surface. This porous design enables effective resin anchoring while maintaining manufacturability through standardized formation processes, achieving both manufacturing precision and thermal stability

Inventive Principle:

Principle #31Porous materials

3Reliability

If recesses are added to the outer electrode to prevent separation, then bonding strength is improved, but device complexity increases

Engineering Contradiction:

Improvebonding strengthVSAvoidelectrode structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The porous structure with multiple recesses is integrated into the outer electrode manufacturing process itself, rather than being added as a separate component. This approach enhances bonding strength through resin anchoring while minimizing device complexity by utilizing the electrode's inherent structure

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively prevents the electronic component and resin layer from separating, enhancing the reliability and stability of the electronic component built-in board under high temperature conditions.

Implementation Method 1

a plurality of recesses are provided in a surface of the outer electrode. Each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a resin included in a resin layer of the multilayer printed circuit substrate is located in the recesses. As such, even if the electronic component built-in board is exposed at a high temperature atmosphere, the electronic component and the resin layer are unlikely to be separated from each other due to an anchor effect

Methodology Applied

Scientific EffectAnchor effect:

Implementation Method 3

since a coefficient of thermal expansion of the electronic component and a coefficient of an interlayer insulation layer are different, there is a case in which the electronic component and the interlayer insulation layer are separated from each other when the temperature of the electronic component built-in board becomes high

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10085344B2Electronic component and electronic component built-in board

Publication Date: 2018.09.25 MURATA MFG CO LTD

AI summary

An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.