Electronic Component Recessed Side Surface Heat Dissipation

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Solution Overview

Problem

Existing electronic components with alternately laminated conductive and insulating layers face challenges in heat dissipation from side surfaces and dicing difficulties, especially when the number of insulating layers is large or their thickness is substantial.

Innovation Solution

The electronic component features a recessed and projecting shape on its side surfaces with a dielectric film covering the recessed part, increasing exposed area for improved heat dissipation and using a manufacturing method that forms sacrificial patterns to facilitate dicing by creating spaces between components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the aggregate substrate is subjected to dicing for individualization, then many pieces of electronic components are obtained, but the side surface of the electronic component is flattened which may not allow heat from the side surface to be satisfactorily dissipated

Engineering Contradiction:

Improvenumber of electronic components obtainedVSAvoidheat dissipation from side surface

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The invention introduces a recessed part and projecting part structure on the side surface of the insulating layer, transforming the flat side surface into a three-dimensional structure with increased surface area. This dimensional change allows heat to be dissipated more effectively from the side surface while maintaining the dicing process for obtaining multiple components

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If the number of insulating layers is large or the thickness of the insulating layer is large, then the electronic component has better performance, but it becomes difficult to dice the aggregate substrate

Engineering Contradiction:

Improveelectronic component performanceVSAvoiddicing difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention forms a sacrificial pattern before the insulating layers are fully formed and before dicing. This sacrificial pattern creates spaces between components that serve as pre-prepared separation zones, making the subsequent dicing process easier even when multiple thick insulating layers are present

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If the side surface of the insulating layer is flattened by dicing, then individualization is achieved, but heat dissipation from the side surface is compromised

Engineering Contradiction:

Improveindividualization of componentsVSAvoidheat dissipation capability

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

By creating recessed and projecting parts on the side surface of the insulating layer, the invention restores and enhances heat dissipation capability in the vertical dimension that was lost due to flattening during dicing, while still achieving component individualization

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11545303B2Electronic component and its manufacturing method

Publication Date: 2023.01.03 TDK CORP

AI summary

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.