Electronic Component Conductive Resin Layer Crack Suppression
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Solution Overview
Problem
Electronic components face issues with cracking due to external forces and thermal shock stress, particularly at the solder fillet, which can lead to durability and reliability problems.
Innovation Solution
The electronic component design incorporates a conductive resin layer with a thickness that gradually increases from the second principle surface to the first principle surface, with the thickest portion near the first principle surface, to absorb external and thermal shock stresses, and covers the ridge portions with a thinner layer to enhance flexibility and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is formed on the end surface to absorb external force, then the reliability of the element body is improved, but the device complexity increases
Solution Approach 1:
The conductive resin layer is applied locally only on the end surface where internal conductors are exposed, rather than uniformly across the entire component. This localized application absorbs external forces at the critical stress point while maintaining simplicity in other regions, resolving the contradiction between reliability improvement and device complexity
Solution Approach 2:
The conductive resin layer is pre-formed on the end surface before soldering, creating a cushioning layer that absorbs external forces and thermal shock stress in advance. This prevents cracks from developing in the element body during subsequent soldering and thermal cycling operations
2Reliability
If the conductive resin layer thickness is increased to absorb thermal shock stress, then the reliability of the solder fillet is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive resin layer is designed with spatially varying thickness: thicker near the first principle surface where thermal shock stress concentrates, and thinner near the second principle surface. This gradient thickness distribution targets stress absorption where needed while reducing manufacturing complexity in less critical regions
Solution Approach 2:
The thickness parameter of the conductive resin layer is optimized to gradually increase from the second principle surface toward the first principle surface. This parameter gradient allows the layer to absorb thermal shock stress effectively while maintaining manufacturability through controlled thickness variation rather than uniform thick application
3Reliability
If the conductive resin layer covers the entire end surface, then the protection against external force is improved, but the moisture resistance deteriorates
Solution Approach 1:
The conductive resin layer covers only the specific region where internal conductors are exposed on the end surface, rather than the entire end surface. This localized coverage provides force absorption protection at the conductor interface while leaving other areas open or covered with different materials that provide moisture resistance
Solution Approach 2:
The conductive resin layer serves as an intermediary between the internal conductors and the external environment, absorbing mechanical stresses and thermal shock while allowing the element body's outer surfaces to maintain their natural moisture-resistant properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the occurrence of cracks in both the element body and solder fillet, improves flexibility, and enhances moisture resistance while maintaining reliable electrical connections.
Implementation Method 1
the conductive resin layer absorbs the external force. Consequently, the one aspect suppresses occurrence of a crack in the element body
Implementation Method 2
the conductive resin layer absorbs the thermal shock stress. The thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction, and the thickest portion is located near the first principle surface in the first direction. The thickest portion of the conductive resin layer is very effective in absorbing the thermal shock stress.
Implementation Method 3
The thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction
Data Source
AI summary
An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.