Electronic Component Conductive Resin Layer Thickness Ratios
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Solution Overview
Problem
The conductive resin layer in electronic components tends to absorb moisture, leading to volume expansion and stress, which can cause cracking and peeling off during solder-mounting due to gasification of absorbed moisture, as the plating layer does not form cohesive contact with the element body, creating a gap that allows gas to escape but also allows moisture to enter, increasing gas generation and absorption.
Innovation Solution
The conductive resin layer is configured with specific thickness ratios between regions on the end surface, side surface, and ridge portions, ensuring that gas generated from the resin reaches the gap effectively, reducing stress on the resin layer and minimizing moisture absorption by optimizing the thickness relationships between these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive resin layer is made thicker to reduce stress, then the reliability improves, but the moisture absorption increases leading to more gas generation and peeling
Solution Approach 1:
The conductive resin layer is designed with different thicknesses in different regions: a first thickness in the first region, a second thickness greater than the first in the second region, and a third thickness greater than the first in the third region. This local variation in thickness allows the layer to have different properties in different areas, enabling stress reduction in critical regions while controlling moisture absorption overall.
Solution Approach 2:
The conductive resin layer is divided into multiple regions (first region, second region, third region) with distinct thickness characteristics. This segmentation allows each region to serve different functions: the first region provides base coverage, while the second and third regions with greater thickness provide stress relief and gas escape pathways without uniformly increasing moisture absorption across the entire layer.
2Strength
If the plating layer is made to cover the element body directly, then the cohesive contact improves, but the gas escape path is blocked causing stress buildup and peeling
Solution Approach 1:
The conductive resin layer acts as an intermediary between the plating layer and the element body. By positioning the plating layer over the conductive resin layer rather than directly on the element body, the system maintains both cohesive contact strength and gas escape pathways. The conductive resin layer mediates the interaction, allowing gas to escape through its structure while providing a bonding surface for the plating layer.
Solution Approach 2:
The plating layer is extracted from direct contact with the element body and positioned instead over the conductive resin layer. This extraction creates a gap or space between the plating layer and element body, which serves as a gas escape path while maintaining the necessary cohesive contact through the conductive resin intermediary.
3Quantity of substance
If the conductive resin layer is made thinner to reduce moisture absorption, then the gas generation decreases, but the stress concentration increases causing peeling
Solution Approach 1:
Rather than uniformly thinning the conductive resin layer, the invention applies local quality by making the layer thinner in the first region while maintaining greater thickness in the second and third regions. This allows the overall moisture absorption to be reduced while critical regions maintain sufficient thickness for stress resistance and gas escape.
Solution Approach 2:
The conductive resin layer is segmented into regions with different thicknesses, allowing the first region to be thinner for reduced moisture absorption while the second and third regions remain thicker to provide stress resistance and gas escape pathways, thus preventing peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively controls the peeling off of the conductive resin layer by ensuring gas generated from moisture absorption is emitted outside, reducing stress and absorption, thereby enhancing the reliability and durability of the electronic component.
Implementation Method 1
The conductive resin layer generally contains a resin and conductive particles. The resin tends to absorb moisture.
Implementation Method 2
In a case in which the electronic component is solder-mounted on an electronic device, the moisture absorbed by the resin may be gasified so that volume expansion may occur.
Implementation Method 3
The plating layer covering the conductive resin layer tends to be in cohesive contact with the conductive resin layer, but tends not to be in cohesive contact with the element body. Therefore, a gap is formed between an end edge of the plating layer and the element body.
Data Source
AI summary
An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation ofT2/T1≥0.11,and the maximum thickness T1 and the minimum thickness T3 satisfy a relation ofT3/T1≥0.11.