Electronic Component With Segmented Insulating Layers
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Solution Overview
Problem
In electronic components where a capacitor and an inductor are integrated, increasing the conductor thickness of the coil pattern to enhance the Q-value of the coil complicates the formation of the capacitor's upper electrode, leading to variations in capacitance and accuracy issues.
Innovation Solution
The electronic component features a substrate with alternately stacked conductor layers and insulating resin layers, where the capacitor is embedded in a thinner, higher-accuracy first insulating resin layer and the inductor in thicker, low-thermal-expansion second insulating resin layers, with specific via conductors shapes to ensure adhesion and prevent warpage and peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductor thickness of the coil pattern is increased to increase the Q-value of the coil, then the Q-value is improved, but the conductor thickness of the capacitor lower electrode is inevitably increased, making it difficult to form an upper electrode on the lower electrode with high accuracy and increasing variation in capacitance
Solution Approach 1:
The patent divides the insulating resin layers into two distinct segments: a first insulating resin layer with smaller thickness for embedding the capacitor, and second insulating resin layers with larger thickness for embedding the coil pattern. This segmentation allows each element to be embedded in an insulating layer optimized for its specific requirements, resolving the contradiction between coil Q-value and capacitor processing accuracy.
Solution Approach 2:
The patent applies local quality by providing different insulating layer thicknesses at different locations where different elements are embedded. The first insulating resin layer has smaller thickness specifically where the capacitor is embedded to enable high processing accuracy, while the second insulating resin layers have larger thickness where the coil pattern is embedded to achieve sufficient conductor thickness and high Q-value.
2Reliability
If the second insulating resin layers have larger thickness to provide sufficient conductor thickness for the coil, then the Q-value is improved, but thermal expansion differences may cause warpage and peeling
Solution Approach 1:
The patent changes the thermal expansion coefficient parameter of the second insulating resin layers by selecting materials with smaller thermal expansion coefficients compared to the first insulating resin layer. This parameter change compensates for the stress caused by thickness differences, preventing warpage and peeling while maintaining the larger thickness needed for high coil Q-value.
Solution Approach 2:
The patent uses composite material strategy by combining different insulating resin materials with different thermal expansion coefficients in a multi-layer structure. The first insulating resin layer and second insulating resin layers are made of different materials selected to have complementary properties, creating a composite structure that simultaneously achieves the needed thickness differential and thermal expansion compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high processing accuracy of the capacitor and sufficient conductor thickness for the inductor, while the low thermal expansion of the second insulating resin layers suppresses warpage and peeling, ensuring the required characteristics for both elements are met.
Implementation Method 1
the second insulating resin layers are smaller in thermal expansion coefficient than the first insulating resin layer
Data Source
AI summary
An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.