Electronic Component Sloped Conductor Plating Adhesion
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Solution Overview
Problem
The existing electronic components face the issue of plating peeling due to tensile stress, which affects the adhesive strength and reliability of the plating layers.
Innovation Solution
The electronic component design includes a conductor with a first slope on its surface, increasing the contact area with the plating layer, and an element body with recesses to enhance adhesive strength, while maintaining a predetermined size, using an Ni plating layer and an Au plating layer to reduce electric resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the plating layer thickness is increased to improve adhesive strength, then the tensile stress in the plating layer increases, but this causes plating peeling
Solution Approach 1:
The second face of the conductor includes a slope (first slope) that is inclined with respect to the outer surface of the element body, creating a curved/angled interface instead of a flat surface. This geometric modification increases the contact area between the conductor and plating layer, improving adhesive strength without increasing plating thickness or tensile stress
2Strength
If the contact area between the conductor and plating layer is increased to improve adhesive strength, then the component size increases, but this is not acceptable for miniaturization
Solution Approach 1:
Instead of increasing the contact area in the planar direction (which would increase component size), the invention utilizes the vertical dimension by creating a slope on the second face. This allows the plating layer to wrap around the conductor, effectively increasing the contact area in three-dimensional space without increasing the overall footprint or volume of the component
3Reliability
If a complex plating structure is used to suppress plating peeling, then the manufacturing complexity increases, but this reduces productivity
Solution Approach 1:
The slope (first slope) on the second face of the conductor is formed in advance during the conductor manufacturing process, before the plating process. This preliminary geometric modification is integrated into the existing manufacturing flow, allowing the subsequent plating process to proceed without additional complex steps, thus maintaining productivity while achieving improved plating adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses plating peeling, improves adhesive strength, and maintains component size, ensuring reliable electrical connections and mounting strength.
Implementation Method 1
The plated electrode layer includes an Ni plating layer and an Au plating layer... it is possible to reduce the electric resistance of the plated electrode layer
Data Source
AI summary
An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.