Electronic Component Side-Surface Grooves for Lower Solder Height
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Solution Overview
Problem
The existing electronic components mounted on substrates with solder joints have a height issue due to the excess joining material, which is undesirable.
Innovation Solution
The electronic component design incorporates side-surface grooves and terminals that utilize capillary action to reduce the amount of joining material between connection terminals and substrate pads, thereby minimizing the component's height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the amount of joining member interposed between electronic component and substrate is increased, then the connection strength is improved, but the height of the electronic component increases
Solution Approach 1:
The patent introduces side-surface grooves that extend from the first main surface toward the second main surface on the side surfaces of the main body portion. These grooves provide an additional dimensional space (lateral dimension) for the joining member to flow into, rather than only accumulating joining member material in the vertical direction between the connection terminals and substrate. This redirects the joining member flow into the grooves, reducing the vertical height while maintaining connection strength through increased surface area for bonding.
2Length of moving object
If the amount of joining member is reduced, then the height of the electronic component is reduced, but the connection strength may be compromised
Solution Approach 1:
The patent creates localized regions (side-surface grooves) with different properties from the main body. These grooves provide concentrated areas for joining member accumulation with increased surface area, while the rest of the structure maintains minimal joining member presence. The grooves act as localized reservoirs that enhance connection strength through increased bonding surface area without requiring excessive joining member material overall, thus reducing height while maintaining strength.
3Length of moving object
If side-surface grooves are introduced to reduce height, then the height is reduced, but the device complexity increases
Solution Approach 1:
The patent segments the side surfaces of the main body portion by introducing grooves that divide the surface into distinct regions. These grooves are simple geometric features that can be integrated into the molding process. The segmentation creates localized areas for joining member flow without requiring complex additional components, maintaining manufacturing simplicity while achieving the height reduction goal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the height of the electronic component by allowing joining members to flow into the grooves, ensuring a secure connection while maintaining a lower profile.
Implementation Method 1
joining members that are interposed between metal pads of a substrate and the connection terminals flow into the side-surface grooves via the side-surface terminals due to the capillary action thereof
Data Source
AI summary
An electronic component includes a main body portion that has a first main surface having first and second sides, a second main surface opposite to the first main surface, a first side surface sharing the first side with the first main surface, and a second side surface sharing the second side with the first main surface, connection terminals that have electrical conductivity and that are arranged on the first main surface so as to be isolated from each other, and side-surface terminals that have electrical conductivity. The main body portion has side-surface grooves that are formed in the first and second side surfaces and that extend from the first main surface toward the second main surface. The side-surface terminals are provided on inner sides of the side-surface grooves and are each electrically connected to at least one of two end portions of the corresponding connection terminal.