Electronic Component Solder Layer Self-Weight Assembly

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Solution Overview

Problem

Conventional electronic components, such as IC packages, face high costs and poor workability due to the complexity of connecting semiconductor substrates with lead terminal pieces using gold bonding wires.

Innovation Solution

An electronic component design featuring a resin frame housing a semiconductor substrate, a plate-shaped metal member with a solder layer and electrical connection region, where the metal member supports the substrate without direct contact and is electrically connected through the solder layer, allowing for simplified assembly and reduced costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If gold bonding wires are used to connect semiconductor substrates with lead terminal pieces, then electrical connection reliability is improved, but manufacturing cost increases and workability deteriorates

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidworkability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive gold bonding wires with inexpensive solder materials that can be easily applied and removed. The solder balls are inexpensive materials that achieve reliable electrical connection without the high cost and complex processing required for gold wires, directly addressing the contradiction between reliability and ease of manufacture

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent replaces the mechanical wire bonding process with a thermal-reflow soldering process. Instead of mechanically attaching gold wires, the invention uses solder balls that are melted and reflowed to create reliable electrical connections, simplifying the manufacturing process and improving workability while maintaining connection reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If gold bonding wires are used to connect semiconductor substrates with lead terminal pieces, then electrical connection reliability is improved, but manufacturing cost increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameter from gold to solder, and the connection method from mechanical wire bonding to thermal-reflow soldering. This parameter change dramatically reduces material cost while maintaining connection reliability through the phase change and reflow process that creates strong metallurgical bonds

Inventive Principle:

Principle #35Parameter changes

3Reliability

If complex connection assembly methods are used, then electrical connection reliability is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the complex wire bonding process and replaces it with a simpler solder ball attachment process. By removing the gold wire bonding step and using directly attachable solder balls with reflow soldering, the invention reduces assembly complexity while maintaining connection reliability through the simplified but effective soldering process

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a self-aligning and self-soldering process where solder balls are placed on the semiconductor substrate and lead terminal pieces, then automatically bonded through reflow heating. This self-service mechanism eliminates the need for complex alignment and bonding equipment, reducing device complexity while ensuring reliable electrical connections

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the connection assembly between semiconductor substrates and plate-shaped metal members, reducing costs and improving workability by using a self-weight placement method with reflow soldering for stable electrical connections.

Implementation Method 1

in the reflow soldering step, when the solder layer is melted with heat, while the semiconductor substrate drops by the self weight, a part of the solder flows in between the plate shape metal member and the electrical connection region portion, and electrical connection is made

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

when the semiconductor substrate is placed by the self weight on the plate shape metal member

Methodology Applied

Scientific EffectGravity: Gravitation

Data Source

PatentUS9646948B2Electronic component and method for manufacturing electronic component

Publication Date: 2017.05.09 SUMIDA CORP

AI summary

An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.