Electronic Component Size Reduction via Vertical Conductive Layer Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic components struggle to minimize size due to the spacing requirements between internal and external connecting portions, which prevents the sealing member from covering the external connecting portion, thereby limiting size reduction.
Innovation Solution
The electronic component features a mounting member with a substrate and conductive layers, where the second conductive pattern for the external connecting portion is spaced apart from the first conductive pattern, allowing the sealing member to cover the internal connecting portion but not the external, thereby reducing the overall size by minimizing the distance between the sealing member and the external connecting portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external connecting portion is spaced away from the sealing member, then the sealing member does not cover the external connecting portion, but the size of the electronic component increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The first and second conductive patterns are arranged in different layers (first conductive layer and second conductive layer), allowing the external connecting portion to be positioned vertically above the internal connecting portion rather than horizontally adjacent to it. This vertical stacking enables the sealing member to cover the internal connecting portion while the external connecting portion extends beyond the sealing member's boundary, thus reducing the overall footprint of the electronic component.
Solution Approach 2:
The patent implements a nested structure where the first conductive pattern (internal connecting portion) is positioned within the area covered by the sealing member, while the second conductive pattern (external connecting portion) is positioned above and extends beyond the sealing member. The conductive layers are stacked such that the second conductive layer is disposed above the first conductive layer, creating a compact nested arrangement that minimizes the horizontal space required while maintaining proper sealing and electrical connectivity.
2Volume of moving object
If the external connecting portion is covered by the sealing member, then the structure is more compact, but the external connecting portion becomes inaccessible for connection
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension. The second conductive pattern (external connecting portion) is positioned in the second conductive layer above the first conductive layer, allowing it to extend beyond the lateral boundaries of the sealing member. This vertical stacking arrangement enables the external connecting portion to be accessible for soldering or other connections while maintaining a compact overall structure, as the connection interfaces are positioned on the top surface rather than requiring lateral extension.
Data Source
AI summary
An electronic component includes an electronic device, a mounting member for mounting the electronic device and having a first connecting portion electrically coupled to the electronic device and a second connecting portion, and a sealing member covering the electronic device and the first connecting portion. The mounting member includes a substrate having a mounting surface mounting the electronic device, a first conductive layer disposed on the mounting surface, and a second conductive layer. The first conductive layer includes a first conductive pattern having the first connecting portion and a second conductive pattern having the second connecting portion and spaced apart from the first conductive pattern in a second direction along the mounting surface. The second conductive pattern is connected to the first conductive pattern through a third conductive pattern included in the second conductive layer. The sealing member does not cover the second conductive pattern.