Substrate-Free Electronic Component With Surface Bumps
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Solution Overview
Problem
Miniaturized electronic components with a resin-based structure are susceptible to static electricity, leading to poor handleability and difficulty in separation, which can result in damage during manufacturing and mounting processes.
Innovation Solution
The electronic component features external electrodes with a resin section made of photoresist, containing bumps or irregularities on at least one surface, which facilitate easy separation by changing surface contact to point contact, improving handleability and mounting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic components are miniaturized to reduce size, then the component dimensions decrease, but the susceptibility to static electricity increases
Solution Approach 1:
The patent applies local quality by creating bumps only on specific surfaces (one or both opposing surfaces) rather than uniformly across the entire component. This localized modification reduces static electricity adhesion at contact points while preserving the overall miniaturized structure and other functional properties of the component.
Solution Approach 2:
Instead of trying to increase weight or size to reduce static electricity susceptibility, the patent inverts the approach by modifying the surface topology to create non-contact points. The bumps create air gaps that prevent direct surface contact, thereby reducing static adhesion without compromising the miniaturized dimensions.
2Length of moving object
If electronic components are miniaturized to reduce size, then the component dimensions decrease, but the handleability deteriorates
Solution Approach 1:
The bumps are localized to specific surfaces where contact occurs during handling and mounting. This local modification improves handleability by preventing sticking at contact points while maintaining the miniaturized overall dimensions and not interfering with other functional areas of the component.
Solution Approach 2:
The patent introduces a vertical dimension (height) to the surface topology by creating bumps with heights of 1-10 μm. This dimensional change transforms flat contact surfaces into non-planar surfaces, creating air gaps that prevent static adhesion while preserving the horizontal footprint of the miniaturized component.
3Length of moving object
If electronic components are miniaturized to reduce size, then the component dimensions decrease, but the separation difficulty increases
Solution Approach 1:
The bumps are strategically placed on surfaces that contact other components or packaging during storage and transport. This localized surface modification prevents sticking at these critical contact points, facilitating easy separation without requiring additional mechanisms or increasing overall component complexity.
Solution Approach 2:
The bumps create curved or rounded contact points rather than flat surfaces. This curvature reduces the contact area and prevents intimate surface-to-surface contact, thereby reducing static electricity adhesion and making separation easier while maintaining the miniaturized component structure.
4Length of moving object
If electronic components are miniaturized to reduce size, then the component dimensions decrease, but the mounting efficiency deteriorates
Solution Approach 1:
The bumps are positioned on surfaces that contact handling equipment or mounting fixtures. This local modification ensures that the mounting process is not hindered by static adhesion, allowing efficient pickup and placement of miniaturized components while maintaining precise positioning.
Solution Approach 2:
The bumps are pre-formed on the component surfaces before mounting operations. This preliminary surface modification prevents static adhesion issues during subsequent handling and mounting processes, ensuring smooth operations without requiring additional steps or interventions during mounting.
Data Source
AI summary
In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.