Electronic Component Terminal Electrode Stress Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic components experience cracks due to stress concentration at the end edges of sintered metal layers when mounted on deflected electronic devices, leading to potential damage and deterioration of electrical characteristics.
Innovation Solution
The electronic component design includes a conductive resin layer that covers the entire end edge of the base metal layer on the mounting face, with a longer clearance at the end portions than at the central portions, dispersing stress and preventing crack formation, and the base metal layer is spaced apart from coil conductors to isolate cracks from affecting electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal electrode is soldered to the electronic device for mounting, then the electronic component can be fixed on the electronic device, but stress concentration occurs at the end edges of the sintered metal layer causing cracks in the body
Solution Approach 1:
The conductive resin layer is designed with non-uniform thickness: a first thickness at the end edge portion and a second thickness at the central portion, where the first thickness is greater than the second thickness. This local quality variation allows the end edge portion to absorb more impact energy and reduce stress concentration, preventing cracks while maintaining mounting reliability
Solution Approach 2:
The conductive resin layer serves as a buffer layer that absorbs impact before it reaches the sintered metal layer. By positioning this cushioning layer between the terminal electrode and the body, and making it thicker at the vulnerable end edge portion, the design preemptively protects against stress concentration and crack formation during mounting and operation
2Strength
If the conductive resin layer covers the entire end edge of the base metal layer, then stress is dispersed and cracks are suppressed, but the manufacturing precision requirement increases
Solution Approach 1:
The conductive resin layer is designed with asymmetric thickness distribution rather than uniform thickness. The first thickness at the end edge portion is intentionally greater than the second thickness at the central portion. This asymmetric design naturally directs the coverage to where it is most needed (end edges) while reducing material usage and simplifying manufacturing constraints
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the occurrence of cracks in the electronic component body, reducing the risk of damage and maintaining the electrical characteristics of the coil conductors.
Implementation Method 1
the conductive resin layer absorbs impact on the end edge of the base metal layer on the one of the main faces
Data Source
AI summary
An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.