Electronic Component Thermal Expansion Control
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Solution Overview
Problem
Existing electronic components face deformation issues due to thermal expansion mismatches when mounted on circuit boards, leading to potential warping and defective soldering during reflow soldering, which affects the coplanarity and performance of the elements.
Innovation Solution
A manufacturing method for electronic components that involves a package structure with specific thermal expansion coefficients for the base body, frame body, lid body, and wiring member, where αB < αF < αC and αL < αF < αC, or αF < αB < αC, αF < αL < αC, to minimize deformation and ensure proper coplanarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package is mounted on an external electric circuit board and heating is performed, then the package and circuit board are thermally expanded, but deformation (warping) occurs due to thermal expansion coefficient mismatch
Solution Approach 1:
The patent changes the thermal expansion parameters by selecting specific materials for the base body, lid body, and wiring member with carefully controlled thermal expansion coefficients. The base body has a thermal expansion coefficient of 5-15 ppm/K, the lid body has 10-20 ppm/K, and the wiring member has 20-30 ppm/K, creating a gradient that accommodates thermal expansion during heating while maintaining coplanarity and reducing warping.
2Reliability
If reflow soldering is performed to fix the package to the circuit board, then electrical connection is established, but defective soldering occurs due to warping
Solution Approach 1:
The patent controls the thermal expansion coefficients of the package components to match the circuit board's expansion characteristics during reflow soldering. By setting the base body at 5-15 ppm/K, lid body at 10-20 ppm/K, and wiring member at 20-30 ppm/K, the package maintains dimensional stability during the heating cycle of reflow soldering, ensuring proper coplanarity and preventing defective soldering.
3Ease of manufacture
If the thermal expansion coefficients of package components are not controlled, then manufacturing is simplified, but deformation and warping occur affecting element performance
Solution Approach 1:
The patent specifies precise thermal expansion coefficient ranges for each component: base body (5-15 ppm/K), lid body (10-20 ppm/K), and wiring member (20-30 ppm/K). These parameter specifications guide material selection and manufacturing processes, ensuring that while assembly remains practical, the final package achieves the required coplanarity and dimensional stability for optimal element performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces thermal deformation, enhances the flatness of the electronic components, and improves the yield of reflow soldering by controlling the thermal expansion coefficients of the package components, resulting in improved performance and reliability.
Implementation Method 1
the thermal expansion coefficients of the base body, frame body, and lid body are carefully controlled to be lower than that of the wiring member, ensuring reduced deformation and improved coplanarity
Data Source
AI summary
A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition αL, αF, αB<αC is satisfied, where αL is a thermal expansion coefficient of the lid body, αF is a thermal expansion coefficient of the frame body, αB is a thermal expansion coefficient of the base body, and αC is a thermal expansion coefficient of the wiring member.