Electronic Component Tray Vacuum Seal Integrity

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Solution Overview

Problem

Existing electronic component packaging fails to maintain a seal due to partial separation of the heat-weld cover sheet caused by external environmental changes such as temperature or air pressure variations.

Innovation Solution

An electronic component package design featuring a main body with multiple recesses, a cover sheet that covers the openings, and a sliding cover, where the electronic components are stored with a volume filling rate of at least 50% to minimize air expansion and maintain the seal across environmental changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cover sheet is heat-welded to seal the storage recess, then the seal prevents entry of foreign substances and dropping of components, but the seal fails due to partial separation caused by air expansion under external environmental changes

Engineering Contradiction:
Improveseal integrityVSAvoidseal stability under environmental change
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The invention extracts and removes the air from the storage recess before sealing, eliminating the problematic substance that causes seal failure. By creating a vacuum or reduced-pressure environment inside the recess, the air that would expand under temperature changes is removed, preventing the cover sheet from separating from the heat-welded seal.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the pressure parameter inside the storage recess by applying vacuum or reduced pressure during sealing. This parameter change ensures that even when external temperature increases cause pressure changes, the internal low-pressure state prevents sufficient expansion force to separate the seal, thereby improving seal stability under environmental variations.

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If the storage recess is filled with electronic components, then the components are protected and stored, but air remaining in the recess expands under temperature changes causing seal separation

Engineering Contradiction:
Improvecomponent storage capacityVSAvoidair expansion effect
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The invention extracts and removes the air from the storage recess before sealing, eliminating the problematic substance that causes seal failure. By creating a vacuum or reduced-pressure environment inside the recess, the air that would expand under temperature changes is removed, preventing the cover sheet from separating from the heat-welded seal.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the pressure parameter inside the storage recess by applying vacuum or reduced pressure during sealing. This parameter change ensures that even when external temperature increases cause pressure changes, the internal low-pressure state prevents sufficient expansion force to separate the seal, thereby improving seal stability under environmental variations.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively maintains the seal of the electronic component package even with external environmental changes, ensuring the integrity and longevity of the components.

Implementation Method 1

the expansion of the air remaining inside the storage recess as the external environment such as temperature or air pressure changes

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP3901055B1Electronic component tray
Publication Date: 2024.01.17 MURATA MFG CO LTD
  • EP3901055B1 patent drawingFigure 1~2
  • EP3901055B1 patent drawingFigure 3
  • EP3901055B1 patent drawingFigure 4A~4B

AI summary

The electronic component package of the present invention includes: an electronic component storage container including: a main body including multiple recesses to store electronic components, the multiple recesses being positioned along a longitudinal direction of the main body and respectively including openings on one side in a height direction of the main body; a cover sheet to cover the openings of the recesses and removably attached to the main body; and a cover positioned such that the cover sheet is between the cover and the main body; and electronic components stored in the recesses of the electronic component storage container; wherein the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of 50% or higher.