Electronic Component Tray Vacuum Seal Integrity
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Solution Overview
Problem
Existing electronic component packaging fails to maintain a seal due to partial separation of the heat-weld cover sheet caused by external environmental changes such as temperature or air pressure variations.
Innovation Solution
An electronic component package design featuring a main body with multiple recesses, a cover sheet that covers the openings, and a sliding cover, where the electronic components are stored with a volume filling rate of at least 50% to minimize air expansion and maintain the seal across environmental changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover sheet is heat-welded to seal the storage recess, then the seal prevents entry of foreign substances and dropping of components, but the seal fails due to partial separation caused by air expansion under external environmental changes
Solution Approach 1:
The invention extracts and removes the air from the storage recess before sealing, eliminating the problematic substance that causes seal failure. By creating a vacuum or reduced-pressure environment inside the recess, the air that would expand under temperature changes is removed, preventing the cover sheet from separating from the heat-welded seal.
Solution Approach 2:
The invention changes the pressure parameter inside the storage recess by applying vacuum or reduced pressure during sealing. This parameter change ensures that even when external temperature increases cause pressure changes, the internal low-pressure state prevents sufficient expansion force to separate the seal, thereby improving seal stability under environmental variations.
2Quantity of substance
If the storage recess is filled with electronic components, then the components are protected and stored, but air remaining in the recess expands under temperature changes causing seal separation
Solution Approach 1:
The invention extracts and removes the air from the storage recess before sealing, eliminating the problematic substance that causes seal failure. By creating a vacuum or reduced-pressure environment inside the recess, the air that would expand under temperature changes is removed, preventing the cover sheet from separating from the heat-welded seal.
Solution Approach 2:
The invention changes the pressure parameter inside the storage recess by applying vacuum or reduced pressure during sealing. This parameter change ensures that even when external temperature increases cause pressure changes, the internal low-pressure state prevents sufficient expansion force to separate the seal, thereby improving seal stability under environmental variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively maintains the seal of the electronic component package even with external environmental changes, ensuring the integrity and longevity of the components.
Implementation Method 1
the expansion of the air remaining inside the storage recess as the external environment such as temperature or air pressure changes
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
The electronic component package of the present invention includes: an electronic component storage container including: a main body including multiple recesses to store electronic components, the multiple recesses being positioned along a longitudinal direction of the main body and respectively including openings on one side in a height direction of the main body; a cover sheet to cover the openings of the recesses and removably attached to the main body; and a cover positioned such that the cover sheet is between the cover and the main body; and electronic components stored in the recesses of the electronic component storage container; wherein the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of 50% or higher.