Electronic Component Via Structure for Stress Dispersion
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Solution Overview
Problem
Existing small electronic components, such as capacitors, face challenges in reducing size and thickness while maintaining performance, due to complex manufacturing processes and stress-related interface delamination issues between internal and external electrodes.
Innovation Solution
The electronic component design features metal layers with different materials separated by dielectric layers, with vias connecting these layers to external electrodes, eliminating the need for separate patterning and reducing stress concentration by dispersing it across multiple connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional capacitor structures with internal electrodes are used, then capacitance function is achieved, but size and thickness cannot be significantly reduced
Solution Approach 1:
The capacitor structure is segmented into multiple functional layers: body part with dielectric layers, via part with conductive vias for electrical connection, and electrode part with external electrodes. This segmentation allows independent optimization of each part, enabling size reduction while maintaining performance through efficient space utilization and reduced parasitic effects.
Solution Approach 2:
The invention transitions from traditional planar electrode arrangements to a three-dimensional stacked structure with dielectric layers and conductive vias. By utilizing the vertical dimension with multiple thin dielectric layers (each 1-10 μm thick) and selective via connections, the component achieves higher capacitance density in reduced thickness while maintaining electrical performance.
2Manufacturing precision
If complex manufacturing processes are used to reduce component size, then precision is improved, but manufacturing complexity increases
Solution Approach 1:
The body part is formed first as a substrate, followed by sequential deposition of dielectric layers and metal layers. Conductive vias are formed through selective etching and filling processes before final electrode attachment. This preliminary structuring simplifies subsequent manufacturing steps and enables precise component dimensions through controlled layer thicknesses.
Solution Approach 2:
The invention achieves precision through controlling critical parameters: dielectric layer thickness (1-10 μm), via dimensions and positioning, and metal layer thickness. By optimizing these parameters, the component attains high manufacturing precision with simplified processes, avoiding the need for excessively complex manufacturing steps.
3Reliability
If internal electrodes are directly connected to external electrodes, then electrical connection is achieved, but stress concentration causes interface delamination
Solution Approach 1:
Conductive vias serve as intermediary elements between the internal electrode structure and external electrodes. These vias are selectively formed through the dielectric layers and provide distributed electrical connections, reducing stress concentration at any single interface. The via structure acts as a mechanical and electrical buffer, preventing delamination while maintaining reliable electrical connectivity.
Solution Approach 2:
The direct connection between internal electrodes and external electrodes is extracted and replaced with a via-based connection system. This separation allows the internal electrode structure to be optimized independently from the external connection requirements, reducing mechanical stress transmission and preventing interface delamination while maintaining electrical functionality.
4Length of stationary object
If component thickness is reduced, then miniaturization is achieved, but design flexibility decreases
Solution Approach 1:
The capacitor is segmented into multiple thin dielectric layers (1-10 μm each) with selective conductive via connections. This segmentation provides design flexibility by allowing different via patterns, layer configurations, and material selections within each layer, enabling customization for various applications while maintaining reduced overall thickness.
Solution Approach 2:
The multi-layer dielectric structure with selective via connections provides universal applicability across different capacitor types and applications. The same basic structure can be adapted for various capacitance values, voltage ratings, and frequency responses by modifying layer thicknesses, dielectric materials, and via configurations, maintaining design flexibility despite reduced thickness.
Data Source
AI summary
An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.