Electronic Control Device Heat Radiation Structure
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Solution Overview
Problem
The existing heat radiation structure for semiconductor modules has a small heat radiation substrate area, leading to insufficient heat radiation capability, and lacks a structure for effectively radiating heat from the housing that accommodates the semiconductor module.
Innovation Solution
An electronic control device with a housing that includes a heat radiation structure featuring a heat radiation block bonded to a first electronic component with a high heat generation amount and a plurality of plate-shaped fins extending from the block, which are connected to a second electronic component with a lower heat generation amount, allowing for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor module with a heat radiation substrate and pin-shaped fins is used, then heat radiation capability is improved to some extent, but the heat radiation substrate area remains small leading to insufficient heat radiation
Solution Approach 1:
The patent transitions from a two-dimensional heat radiation substrate to a three-dimensional heat radiation block with plate-shaped fins extending in multiple directions. This dimensional change significantly increases the heat radiation surface area without proportionally increasing the substrate footprint, thereby resolving the contradiction between limited substrate area and insufficient heat radiation capability
Solution Approach 2:
The heat radiation block is integrated within the housing structure, with the first electronic component mounted on the block and the second electronic component positioned in the space between the block and housing inner wall. This nested arrangement maximizes the use of available space while expanding the effective heat radiation area through the block's external fins
2Power
If higher performance semiconductor devices are used, then device performance is improved, but heat generation amount increases requiring better heat radiation
Solution Approach 1:
The heat radiation block serves as an intermediary thermal management component between the high-power first electronic component and the housing. It conducts heat away from the component and distributes it across its larger surface area and fins, enabling the system to handle higher power devices without excessive heat generation problems
Solution Approach 2:
The heat radiation structure is segmented into distinct functional zones: the heat-bonded interface with the first electronic component, the heat conduction path through the block, and the heat radiation surface with plate-shaped fins. This segmentation allows optimized thermal management for high-power devices by separating heat generation, conduction, and radiation functions
3Temperature
If a heat radiation block with plate-shaped fins is implemented, then heat radiation capability is significantly improved, but device complexity increases
Solution Approach 1:
The heat radiation block is merged with the housing structure, where the block forms an integral part of the housing's internal architecture. The plate-shaped fins are integrated directly onto the block's outer peripheral portion, combining multiple heat radiation surfaces into a single unified structure that reduces overall device complexity while maintaining enhanced heat radiation capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the heat radiation capability of the electronic control device by effectively transferring and radiating heat from the high heat generation component to the surrounding case, reducing junction and surface temperatures, and improving overall heat management.
Implementation Method 1
a heat radiation block 13 which is heat-bonded to the first electronic component 4a
Implementation Method 2
a plurality of plate-shaped heat radiation fins 14 extending outward from an outer peripheral portion of the heat radiation block
Implementation Method 3
a plurality of plate-shaped heat radiation fins 14 extending outward from an outer peripheral portion of the heat radiation block
Data Source
AI summary
Provided is an electronic control device including a first electronic component having a first heat generation amount, a second electronic component having a second heat generation amount smaller than the first heat generation amount, a substrate on which the first and second electronic components are mounted, and a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated. The heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block.