Electronic Control Device Housing With Variable Height Projections
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Solution Overview
Problem
The existing heat dissipation structures in electronic control devices, which use conductive adhesives and protrusions to dissipate heat from high-heat components, can lead to deformation of the circuit board and increased strain on solder joints, reducing connection reliability and increasing manufacturing costs.
Innovation Solution
The electronic control device features a housing with projecting portions of varying heights to contact the substrate via a heat dissipation member, reducing strain on heating elements and improving connection reliability by dispersing heat efficiently through cooling fins and a substrate fixing mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large protrusion is provided on the housing to dissipate heat from multiple adjacent electronic components, then heat dissipation performance is improved, but deformation of the circuit board increases and strain on solder joints increases, decreasing connection reliability
Solution Approach 1:
The housing is divided into multiple projecting portions with different heights, each corresponding to different electronic components. This segmentation allows heat dissipation to be optimized for each component individually without requiring a single large protrusion that would cause excessive board deformation and solder joint strain.
Solution Approach 2:
Different projecting portions are provided with different heights according to the specific heat dissipation needs of each electronic component. This local quality approach ensures that each component receives appropriate heat dissipation without over-engineering the entire housing structure, thereby reducing overall deformation and maintaining connection reliability.
2Temperature
If the circuit board is bonded to the housing via conductive adhesive at positions with large protrusions, then heat is forcibly dissipated to the outside of the housing, but deformation of the circuit board is significantly influenced by deformation of the housing, increasing strain on solder joints
Solution Approach 1:
The bonding structure is segmented into multiple projecting portions with different heights rather than a single large bonding area. This reduces the overall deformation of the circuit board by distributing the bonding stress across multiple smaller, localized areas.
Solution Approach 2:
The bonding characteristics are optimized locally at each projecting portion according to the specific heat dissipation requirements and deformation characteristics of that area. This localized approach minimizes circuit board deformation while maintaining effective heat dissipation at each bonding point.
3Temperature
If surface treatment is performed on the housing to promote absorption and dissipation of heat, then heat dissipation efficiency is improved, but the manufacturing process becomes more complex and cost increases
Solution Approach 1:
Instead of changing the surface properties of the housing through additional treatments, the invention changes the geometric parameters of the housing by providing projecting portions with different heights. This structural parameter change achieves heat dissipation improvement without adding manufacturing complexity or cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration decreases strain on heating elements, enhances connection reliability, and simplifies the manufacturing process by reducing the need for large protrusions and surface treatments, thereby lowering costs and improving heat dissipation efficiency.
Implementation Method 1
The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member
Data Source
AI summary
An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.