Electronic Control Device Noise Reduction via Vertical Substrate Stacking
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Solution Overview
Problem
Existing electronic control devices face challenges in reducing noise generation and mounting surface area due to lengthy power supply paths and limitations in accommodating larger capacitor and coil elements, which hinder compactness and noise resistance.
Innovation Solution
The electronic control device features a configuration that shortens the path from connectors to circuit components, integrating power supply and signal connectors within a connector case, using conducting bars to connect circuit components directly to the control unit, and separating power supply and signal systems to minimize noise interference, while allowing for compact design and efficient component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the power supply path is made long to accommodate more components, then the device can contain more electronic components and circuit lines, but the noise generation increases and the mounting surface area increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked arrangement of substrates. The first substrate (power output), second substrate (connector connection), and third substrate (CPU) are laminated vertically, allowing components to be positioned closer in the vertical dimension while reducing horizontal path lengths, thereby decreasing noise generation without compromising component capacity.
Solution Approach 2:
The patent integrates multiple substrates and circuit paths into a compact laminated structure where the connector, power supply circuit, and control unit are closely coupled through vertical stacking. This merging of previously separate components into a unified three-dimensional assembly reduces the overall path length and mounting surface area while maintaining all necessary functions.
2Quantity of substance
If the power supply path is made long to accommodate more components, then the device can contain more electronic components and circuit lines, but the mounting surface area increases
Solution Approach 1:
The patent utilizes vertical stacking of substrates to transition from two-dimensional planar mounting to three-dimensional spatial arrangement. By laminating the first substrate, second substrate, and third substrate vertically, the device accommodates more components in the vertical dimension, significantly reducing the required horizontal mounting surface area while maintaining all necessary circuit connections and component placements.
Solution Approach 2:
The patent employs a nested arrangement where the second substrate is positioned between the first substrate (power output) and the third substrate (CPU), creating a compact laminated structure. This nesting of substrates allows multiple circuit boards to be integrated in a space-efficient manner, reducing the overall mounting surface area while accommodating all required electronic components and connection terminals.
3Volume of stationary object
If connectors and circuit components are integrated closely, then the device size is reduced, but the complexity of connecting power supply lines and signal lines increases
Solution Approach 1:
The patent divides the control device into functionally segregated substrates: the first substrate for power output circuits, the second substrate for connector connections, and the third substrate for CPU control functions. This segmentation allows each substrate to be optimized for its specific function and simplifies the connection architecture by establishing clear, dedicated connection paths between substrates, reducing overall connection complexity despite the integrated compact design.
Solution Approach 2:
The second substrate serves as an intermediary layer between the first substrate (power output) and the third substrate (CPU). It provides the connection terminals that interface with external connectors while maintaining internal connections to both power and control circuits. This intermediary structure simplifies the overall connection architecture by creating a standardized interface layer that manages the complexity of multiple connection types.
Data Source
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AI summary
Provided is an electronic control device, including: a connector case; two or more connectors including a power supply connector and another connector, the connectors being mounted to an external side of the case; a control unit mounted to an inner side of the case; and a power supply circuit unit including circuit components mounted to the external side of the case, the connectors being mounted apart from each other. The another connector is connected to the control unit by passing through the case not via the power supply circuit unit. The power supply circuit unit includes power supply conducting bars adjacent to each other on an inner side of the case. The power supply conducting bars are connected to the circuit components and the power supply connector by passing through the case and are also connected to the control unit.