Electronic Control Device Thermal Management via Conductivity Grading

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Heat-generated components in electronic control devices can accelerate the heat degradation of components that require vibration countermeasures, such as electrolytic capacitors, due to heat transmission through the metallic housing.

Innovation Solution

An electronic control device design featuring a circuit board with a heat-generating component and a heat-degradable component, where a supporting member with lower heat conductivity than the heat-dissipating member is used to support the heat-degradable component, and a heat-dissipating member with higher conductivity is used to transmit heat to a metallic case for dissipation, preventing heat transfer to the degradable component.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the heat-degradable component is supported by the metallic housing to improve vibration resistance, then the vibration resistance is improved, but the heat generated from the heat-generating component is transmitted to the heat-degradable component via the metallic housing, accelerating heat degradation

Engineering Contradiction:
Improvevibration resistanceVSAvoidheat degradation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A supporting member with low heat conductivity is introduced as an intermediary between the metallic housing and the heat-degradable component. This supporting member provides mechanical support for vibration resistance while blocking heat transmission to the heat-degradable component, thus resolving the contradiction between vibration resistance improvement and heat degradation prevention

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The supporting member is positioned specifically at the location where the heat-degradable component contacts the metallic housing. By localizing the low heat conductivity property to this specific area, the patent provides targeted heat blocking where needed while maintaining overall structural integrity and vibration resistance

Inventive Principle:
Principle #3Local quality

2Loss of energy

If a heat-dissipating member with high heat conductivity is used to transmit heat to the metallic housing, then heat dissipation efficiency is improved, but the supporting member must have lower heat conductivity to prevent heat transfer to the heat-degradable component

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat conductivity requirements
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

Different heat conductivity properties are assigned to different components based on their specific functions: the heat-dissipating member has high heat conductivity to efficiently transfer heat from the heat-generating component to the metallic housing, while the supporting member has low heat conductivity to block heat from reaching the heat-degradable component. This localized differentiation resolves the contradiction by optimizing each component's thermal properties for its specific role

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses heat degradation of heat-degradable components while improving their vibration resistance, enhancing the durability and reliability of in-vehicle electronic control devices.

Implementation Method 1

a heat-dissipating member provided on at least either of the heat-generating component and the first case to transmit the heat generated from the heat-generating component to the first case

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat conductivity of the heat-dissipating member is higher than the heat conductivity of the supporting member... the supporting member can suppress the heat transmitted to the first case from being transmitted to the heat-degradable component

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12108573B2Electronic control device with heat-dissipating members and supporting members
Publication Date: 2024.10.01 KUBOTA CORP
  • US12108573B2 patent drawing
  • US12108573B2 patent drawing
  • US12108573B2 patent drawing

AI summary

An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.