Electronic Device Cover Protrusion Structure for Sharp Pattern Borders
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for forming patterns on electronic device covers, such as embossed and engraved parts, suffer from reduced sharpness due to over-polishing during the manufacturing process, leading to indistinct borders and compromised design integrity.
Innovation Solution
The electronic device cover features protrusions and recesses on its surface, with inclined surfaces extending between these features to maintain sharpness and enhance pattern clarity, preventing excessive polishing and maintaining design intent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If heat and pressure are applied to form embossed and engraved parts on the cover, then the pattern is created, but the border sharpness deteriorates due to over-polishing during the forming process
Solution Approach 1:
The patent applies a release agent to the mold surface before forming the embossed and engraved parts. This preliminary action prevents excessive adhesion between the cover and mold during the forming process, thereby eliminating the need for aggressive polishing that would compromise pattern sharpness. The release agent creates a temporary protective barrier that allows easy separation without damaging the pattern borders.
Solution Approach 2:
The release agent serves as an intermediary substance between the mold and the cover material during the forming process. This intermediary layer prevents direct contact and excessive bonding, allowing the pattern to be formed with sharp borders without requiring subsequent aggressive polishing operations. The release agent mediates the interaction between mold and material to preserve pattern integrity.
2Reliability
If aggressive polishing is performed to eliminate surface defects, then surface quality improves, but the border between embossed and engraved parts becomes indistinct
Solution Approach 1:
The release agent is applied before the forming process to prevent excessive adhesion, which eliminates the root cause of surface defects that would require aggressive polishing. By addressing the adhesion issue preliminarily, the patent avoids the need for subsequent polishing that would compromise border sharpness.
Solution Approach 2:
The patent converts the potential harm of excessive adhesion (which causes surface defects) into a benefit by using the release agent to control the adhesion level. This controlled adhesion allows the pattern to be formed with sharp borders while still maintaining adequate bonding for pattern transfer, thereby eliminating the need for damaging polishing operations.
Data Source
AI summary
Disclosed is an electronic device. The electronic device includes a cover having a front surface defining one surface of the electronic device and a rear surface that is an opposite surface to the front surface, the front surface of the cover includes an upper surface, a lower surface, and an inclined surface extending from a periphery of the upper surface to a periphery of the lower surface toward the rear surface, the cover includes at least one protrusion at least partially formed at the periphery of the upper surface by partially recessing the upper surface in a direction that faces the rear surface, the inclined surface includes a first inclined surface extending substantially flat from the at least one protrusion to a first section of the periphery of the lower surface. Other various embodiments recognized through the specification are possible.