Electronic Device Cooling System with Integrated Air Channel
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Solution Overview
Problem
There is a need to reduce the size of electronic devices such as inverters, converters, and servo amplifiers by improving cooling efficiency, as existing designs often require significant space for cooling systems.
Innovation Solution
The electronic device features a main body and an opposing air channel with a heat sink, cooling fans, and reactors, where the air channel connects to the main body through ducts with filters, allowing for efficient air flow and heat dissipation without obstructing the heat sinks, and positioning reactors on the windward side of the heat sinks to avoid heat interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power converters are cooled by separate cooling fans with separate air flows, then cooling efficiency is improved, but device size increases
Solution Approach 1:
The patent merges the cooling system for power converters and reactors into a single integrated air flow path. The air channel serves both purposes by allowing cooling air to flow through the power converters and then continue to the reactors, eliminating the need for separate cooling fans and air flows while maintaining effective cooling for both components
Solution Approach 2:
The air channel is designed to perform multiple functions: it provides cooling for power converters, continues to cool reactors, and manages air flow through a unified path. This multi-functional design reduces the overall number of cooling components needed while maintaining thermal management effectiveness
2Temperature
If heat sinks are positioned to maximize heat dissipation, then cooling performance is improved, but air flow may be obstructed
Solution Approach 1:
The heat sink fins are oriented perpendicular to the main air flow direction, extending into the air channel in a dimension that maximizes heat dissipation surface area without blocking the flow path. This spatial arrangement allows heat transfer from multiple surfaces while maintaining open air flow channels
3Volume of stationary object
If reactors are positioned close to heat sinks for compact design, then device size is reduced, but heat transfer between components increases
Solution Approach 1:
The air channel is segmented into distinct zones: a first section for power converter cooling and a second section for reactor cooling. This segmentation creates separate thermal zones that prevent heat transfer between components while allowing compact overall design, as each section can be optimized independently for its specific cooling needs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of electronic devices by enhancing cooling efficiency, minimizing heat transfer between components and maintaining air flow purity, thus reducing the risk of dust-related defects and improving overall cooling performance.
Implementation Method 1
a heat sink that is mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter that is tightly mounted on an upper surface of a base of the heat sink
Implementation Method 2
the cooling air flows having flowed through the power converters are supplied to reactors and exhausted as separate flows
Implementation Method 3
cooling fans that are respectively disposed near an air outlet port of the main body and an air outlet port of the air channel
Data Source
AI summary
An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.