Electronic Device Cooling via Segmented Cavity and Active Airflow
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Solution Overview
Problem
Mobile terminal devices experience increased power consumption and heat generation during intense usage, leading to discomfort and compromised safety due to inadequate cooling mechanisms.
Innovation Solution
The electronic device incorporates a rear cover with air inlets and outlets, a middle frame forming a containing cavity, a heat transfer assembly, and a fan to enhance cooling efficiency by actively drawing and discharging air flow, utilizing a heat transfer assembly that may include vapor chambers, heat pipes, or graphene, and a cooling liquid with a lowered boiling point to facilitate effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a mobile terminal device runs large programs (games, videos), then the function and performance are enhanced, but power consumption increases and heat generation increases causing user discomfort and safety issues
Solution Approach 1:
The device is segmented into distinct functional zones: a first cavity housing the heat source component and a second cavity housing the fan, separated by a partition rib. This segmentation allows independent optimization of heat generation and heat dissipation functions, enabling the device to handle large programs while effectively managing the generated heat through dedicated cooling pathways.
Solution Approach 2:
A heat transfer assembly acts as an intermediary between the heat source component and the fan. This intermediary component transfers heat from the heat source to the fan area, where it can be dissipated through the rear cover, thereby decoupling the heat generation process from the heat dissipation process and enabling effective cooling during high-performance operation.
2Device complexity
If natural air flow cooling is used, then the device structure remains simple, but cooling efficiency is insufficient leading to user discomfort and safety performance degradation
Solution Approach 1:
The cooling structure performs preliminary action by proactively drawing cool air from the environment through the air inlet before heat accumulates to problematic levels. The fan creates a predetermined air flow path through the containing cavity, pre-cooling the environment around the heat source component and preventing overheating rather than merely responding to it.
Solution Approach 2:
The device employs pneumatic principles by using a fan to create controlled air flow through the cooling system. The fan generates pressure differential to drive air through the containing cavity, over the heat transfer assembly, and out through the rear cover, transforming passive natural convection into active forced convection for significantly improved cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency and speed, reducing user discomfort and enhancing safety by actively cooling the heat source component, compared to natural air flow methods.
Implementation Method 1
a heat transfer assembly, arranged on a side of the middle frame facing towards the rear cover... the heat transfer assembly is configured to transfer heat of the heat source component to the second end
Implementation Method 2
a fan, arranged opposite to the second end in the containing cavity, and is configured to draw an air flow through the air inlet and discharge the air flow through the air outlet
Data Source
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AI summary
The application relates to an electronic device. The electronic device comprises a rear cover comprising an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source component arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and comprising first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source component are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source component to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.