Electronic Device Destruction Apparatus with Multi-Stage Hammermill
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Solution Overview
Problem
Existing methods for destroying electronic devices are inadequate in ensuring complete destruction and security, particularly for storage devices like hard drives, which may be subject to regulatory and business security requirements.
Innovation Solution
An electronic device destroying apparatus comprising a shredder assembly and two hammermill assemblies, with chutes and screens to progressively reduce the size of electronic device components, ensuring thorough destruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing destruction methods are used, then the process is simple, but the destruction is incomplete and security requirements are not met
Solution Approach 1:
The destruction process is divided into three sequential stages: shredding (reducing to small pieces), first hammermill processing (reducing to granules), and second hammermill processing (reducing to fine powder). Each stage uses specialized equipment configured for its specific function, ensuring progressive and complete destruction while maintaining operational simplicity through automated material transfer between stages.
2Manufacturing precision
If a single destruction device is used, then the device complexity is low, but the size reduction is insufficient
Solution Approach 1:
The size reduction process is segmented into three distinct assemblies: a shredder assembly for initial size reduction, a first hammermill assembly for intermediate reduction, and a second hammermill assembly for final fine powder production. Each assembly is optimized for its specific size reduction task, with screens and chutes ensuring proper material progression through each stage to achieve the required fine powder specification.
Solution Approach 2:
The assemblies are arranged in a nested configuration where the shredder assembly feeds into the first hammermill assembly, which in turn feeds into the second hammermill assembly. This nested arrangement allows material to progress through progressively finer reduction stages, with each assembly containing the previous stage's output and producing output for the next stage, achieving cumulative size reduction.
3Reliability
If progressive size reduction is implemented, then the destruction thoroughness is improved, but the processing time increases
Solution Approach 1:
The three assemblies operate continuously in sequence, with material flowing automatically from the shredder through the first hammermill to the second hammermill via gravity-fed chutes and screens. This continuous operation eliminates idle time between stages, allowing the system to process material through all reduction stages without interruption, achieving thorough destruction while maintaining high processing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces and destroys electronic devices beyond recovery, addressing the inadequacies of existing methods by ensuring complete destruction and compliance with regulatory and business security standards.
Implementation Method 1
a shredder assembly, a first hammermill assembly, and a second hammermill assembly; wherein the shredder assembly is operatively connected to the first hammermill assembly
Implementation Method 2
transferred the plurality of shredder remnants into a first hammermill, resulting in a plurality of first hammermill remnants; transferring the first hammermill remnants into a second hammermill
Data Source
AI summary
Disclosed herein is an apparatus for destroying electronic devices including a shredder assembly, a first hammermill assembly, and a second hammermill assembly. The shredder assembly is operatively connected to the first hammermill assembly and the first hammermill assembly is operatively connected to the second hammermill assembly. The shredding assembly, the first hammermill assembly and the second hammermill assembly are configured to destroy electronic devices.


