Electronic Device Cooling With a Flexible Cold Plate for Lower Cost
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Solution Overview
Problem
Existing electronic devices rely solely on liquid cooling systems for heat dissipation, which are costly due to the use of metal heat sinks for all heating elements.
Innovation Solution
Implement a dual heat dissipation system with a flexible material cold plate for low-power heating elements, connected through a coolant distribution unit, and a separate system for high-power elements, using a coolant distribution unit to circulate coolant and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used for all heating elements, then heat dissipation effectiveness is improved, but cost increases
Solution Approach 1:
The patent divides heating elements into high-power and low-power categories, applying different cooling methods to each segment. High-power elements receive liquid cooling while low-power elements use passive heat sinks, thereby reducing overall system cost while maintaining effective heat dissipation where needed
Solution Approach 2:
The patent applies different cooling qualities to different locations based on heat generation characteristics. High-power elements that generate significant heat receive intensive liquid cooling, while low-power elements use simpler passive cooling, optimizing resource allocation and reducing cost
2Ease of manufacture
If flexible material cold plates are used for low-power heating elements, then cost is reduced, but heat dissipation capability may be compromised
Solution Approach 1:
The patent applies passive heat sinking (which would be excessive for high-power elements) only to low-power heating elements where it is sufficient. This partial application of cooling capability reduces cost while maintaining adequate heat dissipation for the specific thermal load
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from both high-power and low-power elements while reducing the overall cost of liquid cooling by utilizing a flexible material for low-power elements, ensuring efficient heat management.
Implementation Method 1
the coolant distribution unit is configured to cool the coolant in the first cold plate and the second cold plate through circulation
Implementation Method 2
the first cold plate is configured to dissipate heat from a first heating element
Implementation Method 3
the second cold plate is configured to dissipate heat from a second heating element
Implementation Method 4
a heat exchanger, configured to cool the coolant in the first cold plate and the second cold plate through circulation
Data Source
AI summary
An electronic device includes: a first heat dissipation system, including a first cold plate and a first heat dissipation pipe, where the first heat dissipation pipe is connected to the first cold plate and is configured to allow coolant to flow therethrough; a second heat dissipation system, including a second cold plate and a second heat dissipation pipe, the second heat dissipation pipe is configured to allow the coolant to flow through circulation; and a coolant distribution unit. The first heat dissipation pipe and the second heat dissipation pipe are connected to the coolant distribution unit, and the coolant distribution unit is configured to cool the coolant in the first cold plate and the second cold plate through circulation. The second cold plate is made of a flexible material, and power of the first heating element is greater than power of the second heating element.