Electronic Device Grounding via External Conductive Layer
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Solution Overview
Problem
High density of wires among components in electronic devices leads to electromagnetic interference (EMI) issues, necessitating a manufacturing method that addresses this problem.
Innovation Solution
A conductive layer is formed on the exterior of the molding and electrically connected to internal components through the molding, reducing the need for additional wires and minimizing electromagnetic interference by exposing and connecting ground pads using techniques like laser drilling and electroplating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high density of wires are used among components, then connectivity between components is improved, but electromagnetic interference increases
Solution Approach 1:
The patent extracts the ground connection function from the internal wire network and relocates it to the external molding surface. By forming conductive layers on the molding exterior that connect to ground pads, the invention removes the need for dense internal grounding wires, thereby reducing electromagnetic interference while maintaining grounding effectiveness.
Solution Approach 2:
The patent transitions the grounding approach from a two-dimensional internal wire layout to a three-dimensional external conductive layer structure on the molding. This dimensional change allows ground connections to be established without adding to the internal wire density, effectively separating grounding functions from signal transmission paths to reduce EMI.
2Reliability
If additional wires are added for ground connections, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The invention extracts the ground connection requirement from the internal wire network and satisfies it through external conductive layers on the molding. This extraction eliminates the need for additional internal wires dedicated to grounding, reducing overall device complexity while maintaining electrical connectivity.
Solution Approach 2:
The molding structure is given multiple functions: it serves as both the encapsulation housing and as a substrate for external conductive layers. This multi-functionality allows the molding to provide ground connections without requiring separate wire infrastructure, thereby reducing device complexity.
3Reliability
If conventional wire-based grounding is used, then ground connection is achieved, but package volume increases
Solution Approach 1:
The patent merges the grounding function with the existing molding structure by forming conductive layers on its exterior surface. This merging eliminates the need for separate ground wires and their associated routing space, thereby reducing package volume while achieving reliable ground connections.
Solution Approach 2:
The invention moves ground connections from the internal two-dimensional wire plane to the external three-dimensional molding surface. This dimensional transition utilizes the molding's exterior space for grounding, eliminating the need for additional internal wire volume and reducing overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces electromagnetic interference and minimizes the package volume of semiconductor devices, enhancing the design of miniature products by eliminating the need for substrate wires and improving conductivity yields.
Implementation Method 1
forming a first hole on said molding to expose a ground pad of said component
Implementation Method 2
forming a first conductive layer to cover the module and be electrically connected to the ground pad
Data Source
AI summary
An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.