Electronic Device Heat Dissipation Component Assembly
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Solution Overview
Problem
Conventional on-board charger modules (OBCM) for electric vehicles face challenges with heat dissipation due to increasing power density, leading to limited heat-dissipating efficiency and potential overheating issues.
Innovation Solution
The electronic device design includes a bottom case with an accommodation unit for an electromagnetic induction module, a heat-dissipating component positioned separately from the accommodation unit, and an elastic clip that clamps the electronic component between the heat-dissipating component and itself, enhancing physical contact and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power density of the OBCM is increased, then the power conversion capability is improved, but the heat generation increases and heat-dissipating efficiency is limited
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional integrated structure by introducing a separate heat dissipation component. This component is positioned adjacent to the circuit board and electronically isolated from it, allowing heat to be extracted from the electronic components without electrical interference. The heat dissipation component acts as an independent thermal management system that can be optimized separately from the power conversion functionality.
Solution Approach 2:
The patent introduces a heat dissipation component as an intermediary between the circuit board and the surrounding environment. This intermediary structure facilitates heat transfer from the electronic components to the heat dissipation component, which then dissipates heat to the environment. The heat dissipation component serves as a thermal bridge that improves heat transfer efficiency while maintaining electrical isolation.
2Power
If electronic components are mounted on the circuit board, then the power conversion function is achieved, but the heat transfer performance is insufficient without physical contact with heat spreaders
Solution Approach 1:
The heat dissipation component serves as an intermediary thermal pathway between the circuit board and the environment. It is positioned adjacent to the circuit board and provides a dedicated heat transfer route that does not rely on direct contact between electronic components and heat spreaders. The intermediary structure improves thermal coupling while maintaining electrical isolation.
Solution Approach 2:
The patent segments the thermal management function from the electrical function by using a separate heat dissipation component. This segmentation allows the heat dissipation system to be independently optimized and positioned to maximize thermal contact with the circuit board while maintaining electrical isolation. The separated structure enables better heat transfer pathways.
3Device complexity
If conventional hardware configuration is used, then the device structure is simple, but the heat-dissipating efficiency is limited
Solution Approach 1:
The heat dissipation component serves multiple functions: it acts as a thermal management element, provides structural support, and maintains electrical isolation. By combining multiple functions into a single component, the patent improves heat dissipation efficiency without proportionally increasing device complexity. The multi-functional design allows the same structure to serve both thermal and structural purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat-dissipating efficiency, reduces the risk of overheating, and extends the lifespan of electronic components, while also simplifying the assembly process and reducing manufacturing time and cost.
Implementation Method 1
The heat-dissipating component is disposed on the bottom case... enhancing physical contact and thermal conductivity
Data Source
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AI summary
An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is positioned separately from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.