Electronic Device Variable Insulating Layer for Manufacturing Protection
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Solution Overview
Problem
Existing electronic devices are prone to damage during manufacturing due to high temperature, high humidity, or high pressure, affecting their quality and reliability.
Innovation Solution
The electronic device comprises a substrate, a patterned layer with openings, a first electroluminescence element, a circuit layer, and an insulating layer, where the insulating layer has varying distances from the substrate surface to enhance structural integrity and protect the electroluminescence element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing processes are used, then production efficiency is maintained, but materials are easily damaged during high temperature, high humidity or high pressure processes
Solution Approach 1:
The patent applies preliminary action by forming a protective coating layer on the material surface before the manufacturing process. This coating layer is prepared in advance to prevent damage during subsequent high temperature, high humidity or high pressure processes, thereby improving material reliability without compromising production efficiency
Solution Approach 2:
The patent implements beforehand cushioning by introducing a protective coating layer that acts as a buffer between the material and harmful manufacturing conditions. This coating layer absorbs or mitigates the impact of high temperature, high humidity and high pressure, preventing direct damage to the underlying material
2Strength
If the insulating layer is positioned closer to the substrate, then structural integrity is improved, but the electroluminescence element may be more vulnerable during manufacturing
Solution Approach 1:
The patent applies local quality by creating a non-uniform insulating layer with varying thickness. The insulating layer has different distances from the substrate at different locations, providing enhanced protection to the electroluminescence element where needed while maintaining overall structural integrity. This localized variation in insulating layer thickness allows simultaneous optimization of both strength and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and durability of the electronic device by minimizing damage during manufacturing processes.
Implementation Method 1
The insulating layer is disposed above the patterned layer and the first electroluminescence element
Implementation Method 2
The first electroluminescence element is disposed above the substrate, wherein at least a portion of the first electroluminescence element is overlapped with the first opening of the patterned layer
Data Source
AI summary
An electronic device is provided. A patterned layer is disposed above a substrate, and includes patterned structures and a first opening disposed between two patterned structures. A first electroluminescence element is disposed above the substrate and overlapped with the first opening. A circuit layer is disposed above the substrate and electrically connected to the first electroluminescence element. An insulating layer disposed above the patterned layer and the first electroluminescence element has a surface away from the substrate. A part and another part of the surface of the insulating layer are respectively overlapped with the first electroluminescence element and the patterned structure. Along a normal direction of the substrate, a maximum distance between the part of the surface of the insulating layer and a surface of the substrate is greater than a maximum distance between the another part of the surface of the insulating layer and the surface of the substrate.