Electronic Device Mid-Plane Cooling for Dual Heating Elements

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing electronic devices face challenges in effectively dissipating heat generated by multiple heating elements, such as CPUs and GPUs, due to concentrated heat distribution, which affects performance and user comfort.

Innovation Solution

The electronic device incorporates a heat dissipation member positioned between two heating elements, such as a CPU and GPU, to distribute heat dissipation, with independent airflow paths and adjustable vents to manage heat dissipation based on element load, using fans and airflow guidance members to enhance heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple heating elements are arranged close to each other to save space, then device compactness is improved, but heat dissipation effectiveness deteriorates due to concentrated heat

Engineering Contradiction:

Improvedevice compactnessVSAvoidheat dissipation effectiveness

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat dissipation channels, with each heating element having its own dedicated heat dissipation member and airflow path. This segmentation prevents heat concentration by distributing thermal management responsibilities across separate zones, resolving the contradiction between compact arrangement and effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat dissipation member is introduced as an intermediary component positioned between adjacent heating elements. This intermediary absorbs and transfers heat from multiple heating elements, preventing direct heat concentration between elements while maintaining compact device layout.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a single heat dissipation assembly serves multiple heating elements, then device complexity is reduced, but heat dissipation performance deteriorates due to heat concentration

Engineering Contradiction:

Improveheat dissipation structure complexityVSAvoidheat dissipation performance

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The heat dissipation assembly is divided into multiple heat dissipation members, each corresponding to a specific heating element. This segmentation creates independent heat dissipation zones that prevent heat concentration while maintaining manageable structural complexity through modular design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heat dissipation member is specifically designed to serve its corresponding heating element with localized heat dissipation characteristics. This local quality optimization ensures that each heating element receives appropriate heat management without requiring complex global heat dissipation systems.

Inventive Principle:

Principle #3Local quality

3Temperature

If heating elements are arranged at opposite sides of the body, then heat distribution is improved, but heat dissipation path length increases

Engineering Contradiction:

Improveheat distributionVSAvoidheat dissipation path length

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The heat dissipation member positioned between heating elements at opposite sides acts as an intermediary that shortens the effective heat dissipation path. By placing heat dissipation capacity at intermediate locations, the system reduces the distance heat must travel while maintaining improved heat distribution across the device.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation performance, reduces temperature differences between heating elements, and prevents excessive local heating, enhancing user comfort and extending device lifespan.

Implementation Method 1

The heat dissipation member is arranged between the first heating element and the second heating element and configured to dissipate heat for the first heating element and/or the second heating element

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

using fans and airflow guidance members to enhance heat transfer

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250247995A1Electronic device

Publication Date: 2025.07.31 LENOVO (BEIJING) LTD

AI summary

An electronic device includes a body, a first heating element, a second heating element, and a heat dissipation member. The body includes a first side and a second side arranged opposite to the first side. The first heating element is arranged inside the body close to the first side. The second heating element is arranged inside the body close to the second side. The heat dissipation member is arranged between the first heating element and the second heating element and configured to dissipate heat for the first heating element and/or the second heating element.