Electronic Device Module 3D Stacking for Compact Integration
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Solution Overview
Problem
The miniaturization of electronic device modules is hindered by the increased total size resulting from stacking devices, which contradicts the demand for compact and portable electronic products.
Innovation Solution
An electronic device module design featuring a first board with a first device mounted on one surface, a second board disposed below, and multiple second devices interposed between them, where the second devices are bonded to both boards through connection terminals, allowing for a compact structure with an encapsulation part that reduces the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If devices are stacked and mounted to manufacture electronic device modules, then device integration is improved, but total size increases preventing miniaturization
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacking by positioning devices at different vertical levels (first board surface, between boards, second board surface), utilizing the Z-dimension to increase integration without expanding footprint area
Solution Approach 2:
The patent implements nested positioning where the first board is placed on the second board, with devices interleaved between them, creating a compact nested structure that maximizes space utilization and reduces overall module volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the integration of devices, reduces the total thickness of the module, and facilitates its use in thin electronic apparatuses while maintaining electrical connectivity between the boards.
Implementation Method 1
a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board
Data Source
AI summary
In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.