Electronic Device Mounting Surface Area Ratio for Parasitic Capacitance Reduction
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Solution Overview
Problem
In high-frequency electronic devices, parasitic capacities lead to increased losses and waste heat production, which existing technologies have not adequately addressed.
Innovation Solution
An electronic device with a mounting surface significantly larger than its backside electrode, where the mounting surface is designed to reduce parasitic capacities and enhance heat dissipation, utilizing a method of manufacturing that includes encapsulating the device with materials of varying dielectric and thermal conductivity to optimize performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the mounting surface area is increased relative to the backside electrode area, then parasitic capacity is reduced and heat dissipation is improved, but device complexity increases
Solution Approach 1:
The device structure is segmented into distinct functional zones: a large mounting surface area (At) for heat dissipation and electrical connection, and a smaller backside electrode area (Ac) for the die mounting. This segmentation allows the mounting surface area to be at least three times the backside electrode area, reducing parasitic capacity between the mounting surface and backside electrode while maintaining structural manageability through clear functional separation.
2Temperature
If the mounting surface area is increased relative to the backside electrode area, then heat dissipation performance is improved, but manufacturing complexity increases
Solution Approach 1:
The invention applies parameter changes by establishing a specific area ratio relationship between the mounting surface (At) and backside electrode (Ac), where At ≥ 3Ac. This quantitative parameter specification optimizes heat dissipation performance by ensuring sufficient thermal path area while providing clear manufacturing guidelines, thus balancing performance improvement with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces electrical losses and waste heat production at high switching frequencies, improving the overall performance of the electronic device by minimizing parasitic capacities and optimizing heat dissipation.
Implementation Method 1
parasitic capacities are of detrimental effect in particular in case of high frequency devices. In case of increasing switching frequencies of the electronic devices the losses increase due to the parasitic capacity.
Implementation Method 2
a mounting surface configured to mount the electronic device to an external structure... the first size is at least three times the second size
Data Source
AI summary
Various embodiments provide an electronic device, wherein the electronic device comprises a mounting surface configured to mount the electronic device to an external structure and having a first size; a backside electrode having a second size and having arranged thereon a die electrically connected to the backside electrode; wherein the first size is at least three times the second size.