Electronic Device Package with Absorbent Seal Layers
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Solution Overview
Problem
Flexible substrates used in illumination and display devices are prone to moisture and oxygen infiltration, leading to accelerated aging and reduced device lifetime due to inadequate barrier properties, which is particularly problematic for organic light-emitting devices.
Innovation Solution
An electronic device package is created using a substrate, a base film, a first seal, and a second seal with absorbents, where the first seal is between the substrate and the base film, and the second seal is applied on the electronic device, both using the same host materials to encapsulate the device and provide effective moisture and oxygen barrier protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to hold electronic devices, then flexibility and ease of carriage are improved, but moisture infiltration and oxygen diffusion increase, leading to accelerated aging
Solution Approach 1:
The packaging structure is divided into multiple functional layers: a flexible substrate for adaptability, a base film for primary barrier protection, and a seal layer with absorbents for active moisture and oxygen absorption. This segmentation allows each layer to specialize in one function, resolving the contradiction between flexibility and barrier properties.
Solution Approach 2:
The patent uses a composite packaging structure combining a flexible substrate (plastic material) with a base film and seal layer containing desiccants and oxygen absorbers. This composite approach allows the flexible substrate to maintain its flexibility while the composite structure as a whole provides superior moisture and oxygen barrier properties.
2Illumination intensity
If organic light-emitting devices are used, then illumination and display performance are improved, but sensitivity to moisture and oxygen increases, resulting in cathode oxidation and peeling
Solution Approach 1:
The seal layer is pre-loaded with desiccants and oxygen absorbers that activate upon exposure to moisture and oxygen, providing beforehand protection to the organic light-emitting devices. This preemptive cushioning prevents cathode oxidation and peeling before they can occur, allowing the devices to maintain their illumination performance.
Solution Approach 2:
The base film and seal layer act as intermediary protective barriers between the organic light-emitting devices and the harmful external environment. These intermediaries absorb and neutralize moisture and oxygen, preventing direct contact with the sensitive organic compounds and cathode materials.
3Device complexity
If conventional packaging is used without adequate barrier properties, then device complexity is reduced, but device lifetime is shortened due to accelerated aging
Solution Approach 1:
The packaging structure is pre-configured with a base film and seal layer containing absorbents during the manufacturing process. This preliminary action ensures that barrier protection is already in place before the devices are exposed to the external environment, extending device lifetime without requiring complex post-manufacturing modifications.
Solution Approach 2:
The patent employs thin film structures (base film and seal layer) that provide effective moisture and oxygen barrier properties while maintaining a relatively simple and compact packaging structure. These thin films prevent accelerated aging without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the device's lifespan by preventing moisture and oxygen infiltration, ensuring reliable performance and longevity of the electronic devices.
Implementation Method 1
The second seal includes absorbents distributed therein
Implementation Method 2
the flexible substrate such as a plastic substrate may have large coefficient of thermal expansion and insufficient resistance to heat, moisture, oxygen, and chemicals
Data Source
AI summary
An electronic device package including a substrate, a base film, a first seal, an electronic device and a second seal is provided. The first seal is disposed between the substrate and the base film and partially exposed by the base film. The electronic device is formed on the base film. The second seal disposed on the electronic device includes absorbents. A part of the second seal adheres to a part of the first seal exposed by the base film. The first seal and the second seal encapsulate the base film and the electronic device. The first seal and the second seal are the same host materials. A packaging method of an electronic device package is also provided.