Electronic Device Partition Wall Cavity Isolation
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Solution Overview
Problem
Electronic devices with multiple physical quantity sensors in the same package face reliability issues due to decreased airtightness between cavities sealed at different pressures, leading to instability in bonding and reduced functionality.
Innovation Solution
An electronic device design featuring a substrate and cover body with integrated partition walls to isolate cavities, eliminating the need for additional seal members and simplifying the manufacturing process, while using through-holes for sealing under specific air pressure atmospheres to enhance bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple cavities with different inner pressures are formed in the same package, then size reduction and space saving are achieved, but airtightness of the cavities decreases and bonding reliability becomes unstable
Solution Approach 1:
The package is segmented into multiple independent cavities (first cavity and second cavity) with different pressure environments. Each cavity is hermetically sealed and isolated from the others through integrated partition walls formed as part of the substrate structure, preventing pressure equalization while maintaining overall package compactness.
Solution Approach 2:
Multiple cavities with different pressure requirements are combined into a single package structure. The substrate integrates both cavities and their respective sealing structures, eliminating the need for separate packages while maintaining the distinct pressure environments needed for different sensor types.
2Reliability
If multiple bonded portions are used to isolate cavities, then cavity isolation is achieved, but bonding reliability becomes unstable due to sequential bonding processes
Solution Approach 1:
The partition walls are integrated directly into the substrate as a single structural element rather than being separate components requiring additional bonding. This merging of the partition wall function into the substrate eliminates the need for sequential bonding of multiple components, reducing process complexity while maintaining effective cavity isolation.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides the mechanical foundation for the package, creates the partition walls for cavity isolation, and maintains the structural integrity for hermetic sealing. This multi-functionality eliminates the need for separate dedicated partition components.
3Reliability
If seal members are added to block through-holes, then airtightness is improved, but device complexity and production cost increase
Solution Approach 1:
The sealing function is merged into the substrate structure itself through the integrated partition walls and hermetic sealing features. Rather than adding separate seal members, the substrate is designed to provide both structural support and hermetic sealing, eliminating additional components and simplifying the overall device architecture.
Solution Approach 2:
The substrate structure provides its own sealing capability through the integrated partition walls and hermetic sealing features. The partition walls themselves serve as the sealing barrier, eliminating the need for external seal members and reducing device complexity while maintaining airtightness.
Data Source
AI summary
An electronic device includes a substrate, a cover body which is placed on the substrate, a first cavity which is surrounded by the substrate and the cover body, and a second cavity which is surrounded by the substrate and the cover body, wherein an inner portion of the first cavity is sealed in a first air pressure atmosphere, and an inner portion of the second cavity is sealed in a second air pressure atmosphere which has a difference of air pressure with respect to the first air pressure atmosphere, a first through-hole, which communicates with the first cavity and is blocked by a seal member, is provided in at least one of the substrate and the cover body, and the first cavity and the second cavity are isolated from each other by a partition wall portion which is integrally provided to the cover body or the substrate.