Electronic Device Protective Layer for Side Light Leakage

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Solution Overview

Problem

Existing electronic devices face challenges in optimizing the display quality, particularly in reducing side light leakage and improving resolution and contrast, while also requiring a complex and costly manufacturing process.

Innovation Solution

The electronic device design includes a first substrate with a first and second surface, a side circuit layer connected to both surfaces, a light-shielding layer, and a protective layer that extends from the side surface to the second surface, allowing a single process to form the protective layer on both surfaces, reducing process steps and cost, and enhancing display quality by minimizing side light leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the protective layer is formed separately on the side surface and second surface, then the display quality can be improved, but the number of process steps increases and manufacturing cost increases

Engineering Contradiction:
Improvedisplay qualityVSAvoidnumber of process steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the formation of protective layer on the side surface and second surface into a single process step. The protective layer is formed to continuously extend from the side surface to the second surface, eliminating the need for separate coating processes and reducing manufacturing complexity while maintaining display quality improvement benefits

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If the protective layer is formed separately on the side surface and second surface, then the display quality can be improved, but the manufacturing cost increases

Engineering Contradiction:
Improvedisplay qualityVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent combines multiple protective layer formation steps into one process, reducing the number of coating operations, material consumptions, and process cycles. This merging directly reduces manufacturing cost while the continuous extension of the protective layer ensures display quality is maintained through effective side light leakage prevention

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If the protective layer does not continuously extend from side surface to second surface, then the manufacturing process is simpler, but side light leakage occurs and display quality deteriorates

Engineering Contradiction:
Improvemanufacturing processVSAvoidside light leakage
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent addresses side light leakage by extending the protective layer into the third dimension (vertically from side surface to second surface), creating a continuous barrier that blocks light paths from bypassing the display area. This dimensional extension effectively eliminates the harmful light leakage path while remaining compatible with standard manufacturing processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250221136A1Electronic device and manufacturing method thereof
Publication Date: 2025.07.03 INNOLUX CORP
  • US20250221136A1 patent drawing
  • US20250221136A1 patent drawing
  • US20250221136A1 patent drawing

AI summary

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.