Electronic Device Recess Design for Adhesive Overflow Control
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Solution Overview
Problem
During the adhering process of two substrate structures in display devices, excess glue material can overflow, leading to issues in subsequent processes like cutting and bonding, and insufficient glue can result in ineffective bonding.
Innovation Solution
The introduction of a recess design in the electronic device, where the first substrate structure features a first recess formed by a second insulating layer covering electronic elements, and an adhesive layer is disposed between this insulating layer and the second substrate structure, thereby containing the adhesive and reducing overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glue material is applied between two substrate structures for adhering, then bonding is achieved, but glue material may be squeezed outward and overflow during the adhering process
Solution Approach 1:
The patent introduces a recess structure at the peripheral region of the first substrate, creating a localized depression that specifically contains the adhesive layer. This local structural modification allows the adhesive to be confined in the recess area while maintaining normal bonding function, thereby preventing glue overflow without affecting overall bonding strength
Solution Approach 2:
The patent adds a vertical dimension to the substrate surface by creating a recess structure. This dimensional change provides a depth component to contain the adhesive layer, transforming the flat bonding surface into a three-dimensional structure with a depression that physically restricts adhesive flow in the vertical direction
2Reliability
If the amount of glue material is increased to ensure effective bonding, then bonding reliability improves, but the risk of glue overflow increases
Solution Approach 1:
The recess structure creates a localized adhesive containment zone with different geometric properties compared to the rest of the bonding area. This allows sufficient adhesive to be applied for reliable bonding while the recess physically limits the adhesive in specific regions, preventing overflow
Solution Approach 2:
The recess structure is pre-formed on the substrate before adhesive application. This preliminary structural preparation creates built-in adhesive barriers that guide and contain the adhesive layer during the bonding process, preventing overflow before it can occur
Data Source
AI summary
An electronic device includes a first substrate structure, a second substrate structure disposed opposite to the first substrate structure and an adhesive layer. The first substrate structure has a first recess and includes a first base substrate, a first insulating layer disposed on the first base substrate and having an opening, an electronic element disposed on the first base substrate, wherein at least a portion of the electronic element is located in the opening of the first insulating layer, and a second insulating layer disposed on the first insulating layer and the electronic element and covering the electronic element, wherein the second insulating layer forms the first recess. The adhesive layer is disposed between the second insulating layer and the second substrate structure.