Electronic Device Support Structure for Compact Communication Modules
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Solution Overview
Problem
Existing electronic devices face challenges in integrating multiple communication modules efficiently while maintaining a compact form factor, particularly in devices like smartphones and tablets, due to complex wiring and component placement.
Innovation Solution
A novel design incorporating a supporting member with specific installation surfaces and connecting parts that securely fasten circuit boards within a housing, allowing for efficient integration of multiple communication modules and reducing space constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple communication modules are integrated into a compact electronic device, then communication capabilities are enhanced, but structural complexity and wiring complexity increase
Solution Approach 1:
The supporting member is divided into multiple installation surfaces (first installation surface, second installation surface, third installation surface) that can independently hold different circuit boards. This segmentation allows each communication module to be mounted on separate surfaces, reducing wiring complexity while maintaining multiple communication capabilities.
Solution Approach 2:
The supporting member serves multiple functions: it provides mechanical support for multiple circuit boards, acts as a mounting structure for communication modules, and facilitates signal transmission between different modules. This multi-functionality reduces the need for additional separate components, thereby reducing structural complexity.
2Adaptability or versatility
If multiple circuit boards are installed in a compact device, then communication modules are integrated, but space constraints increase
Solution Approach 1:
The supporting member utilizes three-dimensional space by providing installation surfaces at different heights and orientations. The first, second, and third installation surfaces are arranged in space to accommodate multiple circuit boards without requiring excessive planar area, thus fitting multiple modules into a compact footprint.
Solution Approach 2:
The supporting member structure allows circuit boards to be arranged in a nested or stacked configuration where components are positioned at different levels. This nesting approach maximizes the use of vertical space rather than horizontal space, reducing the overall device footprint.
3Strength
If circuit boards are securely fastened to the supporting member, then structural integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The connecting parts are integrated directly into the supporting member structure rather than being separate components. This merging simplifies the manufacturing process by reducing the number of separate parts that need to be assembled, while still providing secure fastening for the circuit boards through features like recesses and positioning structures.
Solution Approach 2:
The supporting member includes self-aligning features such as positioning ribs and recesses that automatically guide circuit boards into correct positions during assembly. This self-service capability reduces the need for complex alignment procedures and specialized manufacturing equipment, simplifying the overall manufacturing process.
Data Source
AI summary
Disclosed is an electronic device including an upper housing and a lower housing, a first circuit board, a second circuit board, and a supporting member connected between the first circuit board and the second circuit board being provided between the upper housing and the lower housing. The supporting member has a first installation surface, a second installation surface, and a bending portion connected between the first installation surface and the second installation surface. The first installation surface is located below the second installation surface and the first circuit board is provided on the first installation surface. A connecting part is provided on the first circuit board, the first circuit board is fixed to the first installation surface by the connecting part, the second circuit board is fixed to the second installation surface, the lower housing is connected with the connecting part.