Electronic Device Metal Carrier for HDD and Interface Card Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices face challenges in heat dissipation due to non-uniform interface card sizes and limited heat-storage space, despite the use of copper or aluminum sheets, which restrict effective heat dissipation.
Innovation Solution
An electronic device design incorporating a heat-dissipation bottom plate, a metal carrier with thermally conductive pads, and a second thermally conductive pad to facilitate heat transfer from components like HDDs, memory modules, and interface cards, providing a large heat-storage space and area for improved dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper sheets or aluminum sheets are added to interface cards to enhance heat dissipation, then heat dissipation capability is improved, but the occupied volume limits the effective heat-storage space and heat-dissipation area
Solution Approach 1:
The patent implements nesting by placing the heat-dissipation plate inside the accommodating space of the metal carrier, and further nesting thermally conductive pads between the heat-dissipation plate and the hard disk drive. This nested arrangement allows multiple heat-dissipation components to occupy the same spatial envelope, effectively increasing heat-storage space and heat-dissipation area without increasing the overall device volume.
Solution Approach 2:
The patent transitions from two-dimensional copper or aluminum sheets attached to interface cards to a three-dimensional heat-dissipation system. The heat-dissipation plate is positioned within the accommodating space, creating vertical heat-dissipation pathways. This dimensional change充分利用 the Z-axis space, significantly increasing the heat-dissipation area without expanding the device footprint.
2Adaptability or versatility
If interface cards from different manufacturers are used, then device compatibility and adaptability are improved, but non-uniform sizes make heat dissipation design difficult
Solution Approach 1:
The patent implements universality through the metal carrier with an accommodating space that can hold a hard disk drive and support various interface cards of different sizes. The heat-dissipation plate and thermally conductive pads are positioned to contact different locations on the interface cards, allowing the same heat-dissipation structure to work with interface cards from different manufacturers with non-uniform sizes.
Solution Approach 2:
The patent applies local quality by positioning thermally conductive pads at specific locations between the heat-dissipation plate and the hard disk drive, and between the heat-dissipation plate and different interface cards. This localized thermal conduction approach allows the heat-dissipation system to adapt to different interface card sizes and configurations, simplifying the overall design while maintaining effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables effective heat dissipation across different brands of components, offering a large heat-storage space and area, enhancing thermal management performance.
Implementation Method 1
The first thermally conductive pads are assembled to the first surface of the metal carrier. The memory module and the at least one interface card are connected to the metal carrier through the first thermally conductive pads
Implementation Method 2
The second thermally conductive pad is assembled to the second surface of the metal carrier. The metal carrier or the HDD is connected to the heat-dissipation bottom plate through the second thermally conductive pad
Implementation Method 3
heat-dissipation bottom plate
Implementation Method 4
heat-dissipation bottom plate
Data Source
AI summary
An electronic device includes a heat-dissipation bottom plate, a metal carrier disposed on the heat-dissipation bottom plate, a plurality of first thermally conductive pads assembled to the metal carrier, and a second thermally conductive pad that is assembled to the metal carrier. The metal carrier has an accommodating space configured to allow a hard disk drive (HDD) to be assembled therein. A memory module and at least one interface card are connected to the metal carrier through the first thermally conductive pads. The metal carrier or the HDD is connected to the heat-dissipation bottom plate through the second thermally conductive pad. The HDD, the memory module, and the at least one interface card are in cooperation with the first thermally conductive pads, the metal carrier, the second thermally conductive pad, and the heat-dissipation bottom plate for heat-dissipation.