Electronic Device Thermal Management via Segmented Heat Dissipation
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Solution Overview
Problem
Electronic devices face challenges with delayed heat dissipation, leading to local overheating, which affects their operating performance and reliability.
Innovation Solution
An electronic device design incorporating a middle frame with a heat transfer unit, a shielding case, and a radiator, where the heat source is positioned between the heat transfer unit and the shielding case, utilizing a vapor chamber and passive heat dissipation structures to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of CPU cores is increased to enhance performance, then processing power is improved, but heat generation increases leading to local overheating
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: heat transfer unit with vapor chamber for rapid heat absorption, shielding case with shielding cavity for heat isolation and directional control, and radiator for heat dissipation. This segmentation allows each component to specialize in a specific heat management task, effectively handling the heat generated by high-power multi-core processors.
Solution Approach 2:
The shielding case acts as an intermediary component between the heat source (CPU) and the external environment. It contains the shielding cavity that directs heat flow toward the radiator while protecting surrounding components from thermal interference, thus mediating the heat transfer process to prevent local overheating.
2Loss of energy
If conventional heat dissipation solutions are used, then some heat is dissipated, but delayed heat dissipation causes local overheating
Solution Approach 1:
The heat transfer unit with vapor chamber is positioned in direct contact with or close to the CPU heat source to perform preliminary heat absorption immediately as heat is generated. The vapor chamber rapidly transfers this heat to the shielding case before it can accumulate and cause local overheating, thus acting in advance to prevent thermal problems.
Solution Approach 2:
The heat dissipation system maintains continuous heat transfer from the heat source through the shielding case to the radiator. The vapor chamber ensures uninterrupted heat absorption and transfer, while the radiator continuously dissipates heat to the environment, creating a continuous heat management process without delays that would cause overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents local overheating by improving heat dissipation efficiency, ensuring stable operation and reliability of electronic devices.
Implementation Method 1
utilizing a vapor chamber
Implementation Method 2
heat transfer unit
Implementation Method 3
The radiator is configured to dissipate heat from at least one of the shielding case or the heat source
Data Source
AI summary
An electronic device is provided in the present disclosure, and the electronic device includes a middle frame, a heat transfer unit, a shielding case, a heat source and a radiator. The middle frame includes a first surface. The heat transfer unit is disposed on the first surface. The shielding case is spaced apart from the heat transfer unit and is provided with a shielding cavity. The heat source is disposed between the heat transfer unit and the shielding case and includes a circuit board disposed on the heat transfer unit and a first heat source component disposed on the circuit board, the first heat source component is disposed in the shielding cavity. The radiator is configured to dissipate heat from the shielding case and/or the heat source.