Electronic Device Through-Hole Layout for Thinner FPC Integration
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Solution Overview
Problem
The conventional design of mobile phones using a three-section architecture with FPCs and a middle frame increases overall thickness due to overlapping components, which is a bottleneck for thinning and poses safety risks near the battery edge.
Innovation Solution
Introduce a first through hole on the middle frame to accommodate the overlapping region of FPCs inside the battery projection, away from the edge, reducing the number of components in the thickness direction and ensuring battery safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If both the main FPC and the screen FPC are disposed in the thickness direction of the mobile phone to make full use of internal space, then the internal space utilization is improved, but the overall thickness of the mobile phone increases
Solution Approach 1:
The patent introduces a through hole in the middle frame to create a new spatial dimension for accommodating the overlapping FPC region. Instead of stacking all components in the thickness direction, the through hole allows the FPCs to be positioned in a different spatial arrangement, effectively using the middle frame's thickness dimension to resolve the overlap and reduce overall device thickness.
2Volume of moving object
If the overlapping position of FPCs is close to the battery edge to save space, then the internal space utilization is improved, but the battery safety deteriorates due to potential damage from hole punching
Solution Approach 1:
The patent applies different positioning strategies to different regions. The through hole is deliberately positioned in the middle frame away from the battery edge, creating a safe zone that protects the battery from potential damage during hole punching. This local quality approach ensures that the critical battery area remains unaffected while still allowing the FPCs to overlap in the middle frame region.
3Length of moving object
If the thickness of the middle frame is reduced to enable thinner device design, then the overall thickness is reduced, but the manufacturing capability deteriorates due to processing limits
Solution Approach 1:
The patent segments the middle frame structure by introducing a through hole that divides the frame into distinct regions. This segmentation allows the FPCs to be positioned in specific areas without requiring the entire middle frame to be thinner. The through hole creates separate zones that can accommodate the overlapping FPC region while maintaining the overall structural integrity and manufacturability of the middle frame.
Data Source
AI summary
An electronic device includes a middle frame, a first flexible printed circuit FPC, a second FPC and a battery. Projections of the first FPC and the second FPC on the middle frame have a first overlapping region. The first overlapping region is located inside a projection of the battery on the middle frame and is far away from an edge of the battery. A first through hole is disposed on the middle frame. The first overlapping region is located in the first through hole. The electronic device provided in this application can implement reduction of an overall thickness, so that the electronic device provides better user experience.