Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods
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Solution Overview
Problem
Electronic devices with diverse semiconductor components require precise temperature regulation, as different components function optimally at different temperature ranges, with cryogenic temperatures benefiting some while higher temperatures are necessary for others, leading to inefficiencies and performance issues.
Innovation Solution
The implementation of dual thermal regulation systems within electronic devices, comprising a cryogenic liquid cooling circuit for maintaining cryogenic temperatures and a non-cryogenic cooling or heating system to manage temperatures above cryogenic levels, allowing for independent temperature control of logic and memory circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single temperature regulation system is used for the entire electronic device, then the structure is simple, but different semiconductor components cannot operate at their optimal temperatures
Solution Approach 1:
The electronic device is divided into multiple thermal zones with separate temperature regulation systems. A first temperature regulation system controls a first semiconductor component (e.g., logic circuit) at a first temperature, while a second temperature regulation system controls a second semiconductor component (e.g., memory circuit) at a second temperature. This segmentation allows each component to operate at its optimal temperature independently.
Solution Approach 2:
Different portions of the electronic device are assigned different thermal characteristics and temperature control mechanisms. The first semiconductor component is provided with a first temperature regulation system optimized for its specific thermal requirements, while the second semiconductor component has a second temperature regulation system tailored to its needs, enabling localized temperature optimization.
2Reliability
If cryogenic temperatures are used for logic circuits, then performance and reliability improve, but memory circuits and other components cannot function properly
Solution Approach 1:
The device is segmented into distinct thermal management zones where logic circuits can be cooled to cryogenic temperatures for improved reliability while memory circuits and other components are maintained at higher temperatures suitable for their operation. Separate temperature regulation systems enable this differential temperature control.
Solution Approach 2:
Different thermal environments are created for different circuit types within the same device. Logic circuits receive cryogenic cooling for enhanced performance and reliability, while memory circuits are provided with moderate temperature control to ensure they remain functional, achieving local thermal optimization.
3Ease of operation
If higher temperatures are used for memory circuits, then operation is maintained, but logic circuits experience reduced performance and increased errors
Solution Approach 1:
The temperature regulation system is segmented into independent control zones. Memory circuits are maintained at higher temperatures that ensure proper operation, while logic circuits are separately cooled to lower temperatures that improve performance and reduce errors, with each zone having its own temperature control mechanism.
Solution Approach 2:
Different temperature conditions are applied locally to different circuit types. Memory circuits operate at elevated temperatures suitable for their function, while logic circuits are provided with enhanced cooling to maintain high performance and reliability, allowing each component type to operate in its optimal thermal environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This dual thermal regulation system enhances the performance and reliability of electronic devices by maintaining optimal temperatures for each component, enabling efficient operation across a wide temperature range, from cryogenic to ambient temperatures.
Implementation Method 1
a first thermal circuit (e.g., the cryogenic liquid cooling circuit) can be provided for managing a first operating temperature of the first functional circuit
Implementation Method 2
a second thermal circuit (e.g., the non-cryogenic cooling or heating system) can be provided for managing a second operating temperature of the second functional circuit
Data Source
AI summary
A semiconductor device includes a substrate; a first functional circuit attached to the substrate; a first thermal circuit attached to the substrate, configured to utilize cryogenic liquid to cool the first functional circuit; a second functional circuit attached to the substrate; and a second thermal circuit attached to the substrate, configured to cool the second functional circuit without using the cryogenic liquid.