Electronic Apparatus With Differential Heat Paths for Component Limits

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Solution Overview

Problem

Existing heat radiating structures in image pickup apparatuses, such as those described in Japanese Patents 6981610 and 2005-129734, fail to consider the permissible upper limit temperatures of individual electronic components, leading to operational limitations due to excessive heat transfer.

Innovation Solution

A heat radiating structure comprising a sheet metal, a first heat conductive member with a flexible connector, a second heat conductive member, and an elastic member that presses the connector against the sheet metal, ensuring differential heat management and preventing excessive heat transfer to exterior components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat radiating structure is used to radiate heat from electronic components, then heat dissipation is improved, but the permissible upper limit temperature of individual components may be exceeded causing operational limitations

Engineering Contradiction:

Improveheat dissipationVSAvoidoperational reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat radiating structure is divided into multiple independent heat radiating members, each dedicated to a specific electronic component. This segmentation allows each component to have its own controlled heat dissipation path, preventing heat accumulation that would exceed permissible temperature limits and ensuring operational reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heat radiating member is specifically designed and positioned to contact a particular electronic component, providing localized heat management. This allows differential heat management where each component's thermal characteristics can be optimized independently, ensuring that no single component exceeds its permissible upper limit temperature.

Inventive Principle:

Principle #3Local quality

2Temperature

If heat is radiated uniformly from all electronic components, then overall heat dissipation is improved, but the permissible upper limit temperature of one component limits the operation of other components

Engineering Contradiction:

Improveheat dissipationVSAvoidoperational flexibility

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The uniform heat radiating structure is segmented into multiple independent heat radiating members, each associated with a specific electronic component. This allows each component to operate independently within its own thermal envelope, enabling greater operational flexibility where one component's temperature constraints do not limit the operation of others.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat radiating members are designed to dynamically adapt to the thermal needs of individual components. Each member can independently manage heat flow based on the specific thermal characteristics and operational requirements of its associated component, allowing the system to maintain operational flexibility across varying workloads.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively manages heat distribution among electronic components, preventing overheating and ensuring stable operation by maintaining component temperatures below their permissible limits, thereby avoiding premature shutdowns.

Implementation Method 1

an elastic member provided inside the exterior member and between the first electronic component and the sheet metal and having a thermal conductivity lower than that of the first heat conductive member. The second connector is pressed against the sheet metal by an elastic force of the elastic member.

Methodology Applied

Scientific EffectElastic force: Elasticity

Implementation Method 2

a first heat conductive member provided inside the exterior member and including a first connector thermally connected to the second electronic component and a second connector thermally connected to the sheet metal

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12439566B2Electronic apparatus

Publication Date: 2025.10.07 CANON KK

AI summary

An electronic apparatus includes an exterior member, a first electronic component and a second electronic component each provided inside the exterior member, a sheet metal provided inside the exterior member and spaced from each of the first electronic component and the second electronic component, a first heat conductive member provided inside the exterior member and including a first connector thermally connected to the second electronic component and a second connector thermally connected to the sheet metal, and an elastic member provided inside the exterior member and between the first electronic component and the sheet metal and having a thermal conductivity lower than that of the first heat conductive member. The second connector is pressed against the sheet metal by an elastic force of the elastic member.