Electronic Document Inlay for Secure Chip Port Connection
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Solution Overview
Problem
Existing electronic documents do not effectively render a module inoperative when separated from the document body, which is a security concern as the module can remain operational even after detachment.
Innovation Solution
Incorporating an inlay within the document body that forms a connection land on the spotface, with an electrical circuit comprising a first subcircuit connecting the chip port to the inlay and a second subcircuit connecting the inlay to the external contact land, ensuring the module becomes inoperative upon separation by breaking the electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the module is directly connected to external contact lands without an inlay, then the electrical connection is simple and direct, but the module remains operational even when separated from the document body
Solution Approach 1:
An inlay is introduced as an intermediary component between the module and the document body. The inlay includes a connection land that forms an electrical connection with the module's external contact lands when the module is inserted into the cavity. This intermediary structure ensures that when the module is separated from the document body, the electrical connection is broken, rendering the module inoperative, while maintaining a relatively simple overall structure.
2Reliability
If the electrical connection is made via an inlay inside the document body, then the module becomes inoperative when detached, but the electrical connection path becomes more complex with multiple subcircuits
Solution Approach 1:
The electrical connection is segmented into two distinct subcircuits: a first subcircuit that connects the module port to the inlay connection land, and a second subcircuit that connects the inlay connection land to the external contact land. This segmentation ensures that when the module is detached, both subcircuits are broken, providing reliable security. The segmentation is implemented in a way that adds functional complexity but maintains manufacturing feasibility through standardized inlay components.
3Stability of the object's composition
If the cavity is designed with a deep central portion and shallow peripheral spotface, then the module can be securely housed with proper alignment, but the manufacturing process becomes more complex
Solution Approach 1:
The cavity is designed with different depths in different regions: a deep central portion for housing the module chip and a shallow peripheral spotface for forming the electrical connection land. This local quality differentiation ensures that the module is securely positioned with proper alignment while the spotface provides a stable surface for electrical connection. The varied depth structure is manufactured using precision molding or machining techniques that can create different depths in single operations, balancing manufacturing complexity with positioning stability.
Data Source
AI summary
Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.