Electronic Structure With Dual-Modulus Joint Members

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The challenge in the electronic industry is to develop a package structure that enhances stability and line density while accommodating the thermal expansion differences between components, particularly when transitioning from high-temperature environments to room temperature, without compromising the fine pitch configuration.

Innovation Solution

The proposed electronic structure incorporates joint members with varying Young's moduli and melting temperatures, where the first joint member is made of materials like tin or gold and the second joint member is made of copper, allowing for tolerance of thermal shifts and twists while maintaining a compact structure through controlled deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If joint members with uniform Young's modulus are used, then the structure is simple to manufacture, but the structure cannot effectively tolerate thermal shifts and twists

Engineering Contradiction:

Improvethermal stabilityVSAvoidjoint member composition

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by assigning different Young's moduli to different joint members based on their specific functional requirements. The first joint member (lower Young's modulus) is positioned to accommodate thermal expansion, while the second joint member (higher Young's modulus) provides structural support. This localized differentiation of material properties enables the structure to tolerate thermal shifts while maintaining overall simplicity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining joint members made of different materials with distinct Young's moduli. The first joint member is made of a material with lower Young's modulus (more flexible), while the second joint member uses a material with higher Young's modulus (stiffer). This composite approach allows the joint structure to simultaneously handle thermal expansion and provide mechanical support.

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the joint structure is made rigid to maintain precision, then manufacturing precision is improved, but the structure cannot accommodate thermal expansion differences

Engineering Contradiction:

Improvefine pitch configurationVSAvoidthermal expansion tolerance

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent applies parameter changes by varying the Young's modulus parameter across different joint members. The first joint member has a lower Young's modulus to allow thermal expansion, while the second joint member has a higher Young's modulus to maintain precision. This parameter differentiation enables the structure to adapt to thermal changes while preserving manufacturing precision in critical areas.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent segments the joint structure into multiple joint members with different mechanical properties. The first joint member is segmented to handle thermal expansion, while the second joint member is segmented to maintain structural precision. This segmentation allows each part to optimize its function independently.

Inventive Principle:

Principle #1Segmentation

3Reliability

If the joint members deform to accommodate thermal shifts, then thermal stability is improved, but the joint structure may occupy excessive space

Engineering Contradiction:

Improvethermal shift toleranceVSAvoidjoint structure volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent employs flexible joint members with optimized geometries that can deform to accommodate thermal expansion. The first joint member with lower Young's modulus is designed with appropriate thickness and shape to provide flexibility while minimizing volume. This allows thermal shift tolerance without excessive space occupation.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively stabilizes the electronic structure, prevents damage from thermal expansion, and enables fine pitch configurations by ensuring the joint structure does not occupy excessive space, even after temperature changes.

Implementation Method 1

allowing for tolerance of thermal shifts and twists while maintaining a compact structure through controlled deformation

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the first joint member has a first Young's modulus... the second joint member has a second Young's modulus, and the second Young's modulus is greater than the first Young's modulus

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS10076034B2Electronic structure

Publication Date: 2018.09.11 NAN YA TECH

AI summary

An electronic structure is provided. The electronic structure includes a first board structure, a first contact pad, a first joint member, and a second joint member. The first contact pad is disposed on the first board structure. The first joint member is disposed on the first contact pad, in which the first joint member has a first Young's modulus. The second joint member is disposed on the first joint member, in which the second Young's modulus has a second Young's modulus, and the second Young's modulus is greater than the first Young's modulus.