Electronic Element Insulating Layer Thickness for Display Lamination Stability
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Solution Overview
Problem
In thin display devices, electronic elements with bumps can deform during high-temperature lamination due to height differences, leading to poor adhesion to substrates and reduced conductivity.
Innovation Solution
A first electronic element with a substrate, an electrode pad, and an insulating layer having an opening that overlaps the electrode pad, where the distance between the insulating layer's surface and the electrode pad's surface is between 0 μm and 14 μm, preventing protrusion and ensuring stable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic elements with bumps are used for connection, then electrical connectivity is improved, but height difference causes deformation during high-temperature lamination
Solution Approach 1:
The insulating layer is designed with a predetermined thickness (0-14 μm) before the lamination process to pre-compensate for the height difference caused by bumps. This preliminary structural arrangement prevents deformation during high-temperature lamination by ensuring the electrode pad surface is adequately supported, allowing both electrical connectivity through bumps and structural stability during manufacturing.
2Stability of the object's composition
If the insulating layer thickness is increased to cover bumps, then deformation is reduced, but adhesion to substrate deteriorates
Solution Approach 1:
The insulating layer thickness is precisely controlled within the range of 0-14 μm to optimize both structural stability and adhesion strength. This parameter optimization ensures the insulating layer is thick enough to prevent deformation from bump height differences but thin enough to maintain good adhesion to the substrate, resolving the contradiction between these two requirements.
3Strength
If high-temperature lamination is applied for bonding, then adhesion is improved, but electrode pad deformation increases
Solution Approach 1:
The insulating layer acts as a cushioning structure with optimized thickness (0-14 μm) that protects the electrode pad from deformation during high-temperature lamination. This beforehand cushioning allows the lamination process to achieve good adhesion strength while the insulating layer prevents excessive heat and pressure from deforming the electrode pad, enabling both strong bonding and shape preservation.
Data Source
AI summary
A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.