Electronic Element Module Thinning via Substrate Insertion
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Solution Overview
Problem
The existing LED modules for displays face challenges in reducing overall thickness due to the thickness of both the BLU substrate and the LED elements, which affects signal transmission characteristics and module thickness.
Innovation Solution
The solution involves directly placing electronic elements on a substrate with a build-up structure that includes through-portions with openings, where electrode pads of the elements are disposed within these openings, and a conductive adhesive is used to fill the openings, allowing for a thinner module with improved signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED elements are disposed on the surface of the BLU substrate in surface mount form, then the LED elements can be securely mounted and electrically connected, but the overall thickness of the display increases due to the thickness of both the substrate and LED elements
Solution Approach 1:
The electrode pads of the LED element are inserted into openings formed in the BLU substrate, nesting the pads within the substrate thickness rather than mounting them on the surface. This allows the LED element to be positioned at a reduced height from the substrate surface, thereby reducing the overall module thickness while maintaining secure electrical connection through the conductive adhesive filling the openings.
Solution Approach 2:
The invention transitions from traditional surface-mount positioning (two-dimensional surface placement) to a three-dimensional configuration where electrode pads are inserted vertically into the substrate openings. This dimensional change allows the pads to be embedded within the substrate volume, reducing the vertical profile of the assembled module while preserving connection integrity.
2Length of stationary object
If the thickness of the BLU substrate and LED element are reduced to thin the display, then the overall thickness decreases, but signal transmission characteristics deteriorate
Solution Approach 1:
A conductive adhesive is introduced as an intermediary material filling the openings in the substrate where the LED electrode pads are inserted. This conductive adhesive serves multiple functions: it provides mechanical support and stabilization to the thin pads, ensures reliable electrical connection between the pads and the substrate wiring, and maintains signal transmission integrity even when the overall module thickness is reduced. The intermediary material compensates for the potential signal degradation that would result from thinning the display.
3Length of stationary object
If electrode pads are inserted into openings in the substrate, then the module can be thinned and signal paths shortened, but the manufacturing process becomes more complex
Solution Approach 1:
The openings for receiving the LED electrode pads are pre-formed in the BLU substrate during the substrate manufacturing process, before the LED element assembly is attached. This preliminary action integrates the opening formation into the existing substrate fabrication workflow, avoiding the need for additional post-assembly processing steps. The conductive adhesive is also pre-applied to the substrate openings prior to LED element placement, streamlining the assembly process and reducing manufacturing complexity despite the advanced structural requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the thinning of the electronic element module, shortens signal paths, and enhances signal transmission characteristics by stabilizing the electrode pads and conductive adhesive within the substrate openings.
Implementation Method 1
a conductive adhesive disposed in at least a portion of each of the plurality of first openings
Implementation Method 2
a conductive adhesive disposed in at least a portion of each of the plurality of first openings
Data Source
AI summary
The present disclosure relates to an electronic element module including a printed circuit board including a first insulating layer having a plurality of first openings, and a build-up structure disposed on one surface of the first insulating layer and having a first through-portion, wherein the plurality of first openings are disposed in the first through-portion on a plane; a conductive adhesive disposed in at least a portion of each of the plurality of first openings; and a first electronic element disposed in the first through-portion, and having a plurality of first electrode pads disposed. At least a portion of each of the plurality of first electrode pads is disposed in the plurality of first openings.